Semiconductor Device Offset Lead Frame Resin Flow Stability
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Solution Overview
Problem
The challenge in semiconductor device manufacturing is the reduction of reliability and increased manufacturing cost due to the arrangement of sensor and controller chips in an array, where the thickness difference between the chips leads to instability in resin flow during sealing, causing potential short circuits and reduced reliability, and the need for closer lead arrangement compromises the balance and stability of the device.
Innovation Solution
A semiconductor device design with a die pad and suspending leads where the sensor and controller chips are mounted in an array, with a silicon chip interposed between the sensor chip and the die pad to adjust linear expansion coefficients and reduce stress, and leads are arranged closer to the controller chip to minimize wire length and prevent short circuits, using a lead frame with offset parts to ensure proper resin flow and sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If leads are arranged closer to the controller chip to minimize wire length, then short circuit risk is reduced, but the balance and stability of the device is compromised
Solution Approach 1:
The patent introduces a third dimension (vertical offset) to resolve the two-dimensional contradiction between lead proximity and device balance. By forming suspending leads with different lengths that create offset positions, the design allows leads to be electrically close to the controller chip while maintaining physical balance through vertical staggering, thus preventing both short circuits and maintaining stability.
Solution Approach 2:
The suspending leads are segmented into multiple sections with different lengths, creating offset positions for the die pad relative to the leads. This segmentation allows the leads to be arranged in a gathered manner near the controller chip while the offset structure distributes the mechanical load, maintaining device balance and stability.
2Volume of moving object
If sensor chip and controller chip are arranged in an array, then device thickness is reduced, but resin flow stability during sealing is compromised
Solution Approach 1:
The patent uses vertical offset positioning (third dimension) to resolve the planar arrangement problem. By creating offset positions for the die pad and leads through varying suspending lead lengths, the design maintains compact array arrangement for thin profile while the vertical offset creates proper resin flow paths, stabilizing resin flow during sealing process.
3Length of moving object
If leads are arranged in a gathered manner near the controller chip, then wire length is minimized, but mounting stability is reduced
Solution Approach 1:
The patent introduces vertical offset positioning to resolve the contradiction between gathered lead arrangement and mounting stability. Leads are arranged close to the controller chip in planar view for short wire length, while the offset structure created by varying suspending lead lengths provides vertical distribution that maintains mounting stability and balance.
Solution Approach 2:
The suspending leads are segmented into different length sections, creating offset positions that allow the leads to be gathered near the controller chip electrically while providing vertical separation that maintains mechanical stability for mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of the semiconductor device by stabilizing the resin flow and reducing the risk of short circuits, while also reducing manufacturing costs through efficient lead arrangement and using a silicon chip to manage thermal expansion, thereby improving the overall stability and performance of the device.
Implementation Method 1
a silicon chip interposed between the sensor chip and the die pad to adjust linear expansion coefficients and reduce stress
Data Source
AI summary
The reliability of a semiconductor device is prevented from being reduced. A planar shape of a sealing body is comprised of a quadrangle having a pair of first sides, and a pair of second sides crossing with the first sides. Further, it has a die pad, a controller chip (first semiconductor chip) and a sensor chip (second semiconductor chip) mounted over the die pad, and a plurality of leads arranged along the first sides of the sealing body. The controller chip and the leads are electrically coupled to each other via wires (first wires), and the sensor chip and the controller chip are electrically coupled to each other via wires (second wires). Herein, the die pad is supported by a plurality of suspending leads formed integrally with the die pad and extending from the die pad toward the first sides of the sealing body. Each of the suspending leads has an offset part.