Semiconductor Device Oil Leakage Prevention
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Solution Overview
Problem
In semiconductor devices, a trace amount of oil components from sealing materials can leak out, especially when the device is mounted at an angle, causing issues with neighboring electronic circuits due to the leakage of oil components through the boundary surfaces between the lid and case portions.
Innovation Solution
The semiconductor device incorporates projection or dent portions on the wall surfaces between the opening ends and the sealing material to prevent oil component leakage by creating a barrier or storage area, thereby minimizing the area where oil can leak and spread.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor device is equipped on a vertical surface at an angle, then the insulation performance between circuits is improved, but the leakage of oil component to the outside becomes significant
Solution Approach 1:
The projection portion or dent portion is provided in advance on the wall portion between the opening end and the sealing material side. This preliminary structural arrangement creates a barrier that prevents oil component leakage before the leakage can occur, especially when the device is equipped on a vertical surface where gravity would otherwise cause significant leakage.
Solution Approach 2:
The projection portion or dent portion acts as an intermediary structure between the sealing material and the opening end. This intermediate feature blocks the path of oil components, preventing them from reaching the boundary surface and leaking outward, thus resolving the contradiction between maintaining insulation performance and preventing oil leakage.
2Object-generated harmful factors
If the opening end is positioned lower than the sealing material, then the oil component leakage is reduced, but the device complexity increases due to additional structural features
Solution Approach 1:
Instead of changing the overall device structure or positioning, the projection portion or dent portion is introduced as a localized feature on a specific wall portion. This local modification creates the necessary barrier function without significantly increasing overall device complexity, allowing the opening end to remain positioned lower than the sealing material while minimizing structural complications.
Solution Approach 2:
The wall portion is segmented by adding a projection portion or dent portion, dividing the continuous surface into distinct regions. This segmentation creates a functional barrier that prevents oil leakage while maintaining the overall simplicity of the case portion structure, as the added feature is a discrete element rather than a complex reconfiguration.
Data Source
AI summary
A semiconductor device is provided comprising a semiconductor element, a case portion housing the semiconductor element and having an opening end on at least some of wall portion, a lid portion covering the opening end of the case portion, and a sealing material sealing the semiconductor element inside the case portion, where a projection portion or a dent portion is provided on a surface of the wall portion close to the sealing material between the opening end and the sealing material. The Purpose is to prevent an oil leakage from a semiconductor device. Also, instead of the projection portion or the dent portion, a semiconductor device is provided with a liquid receiving portion that receives a liquid dripping from the opening end on a surface facing away from the sealing material.