Semiconductor Device Optical Chip Bonding
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Solution Overview
Problem
As integrated circuits (ICs) become smaller and faster, electrical signal delays due to capacitance, inductance, or resistance become a design concern, leading to the use of optical signals, which requires a combination of electrical and optical chips in IC packages, complicating design and potentially causing signal delay issues.
Innovation Solution
A semiconductor device comprising a first electrical chip and a second optical chip arranged on opposite sides of a re-distribution layer, with the optical chip bonded to the layer after forming a molding material around the electrical chip, allowing for accurate optical alignment and a compact multichip module (MCM) with enhanced signal isolation and thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electrical signals are used in integrated circuits, then the ICs can operate at high speed, but signal delays caused by capacitance, inductance, or resistance become a design concern
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission. Optical signals use light photons instead of electrical electrons, eliminating the capacitance, inductance, and resistance issues that cause signal delays in electrical circuits. This substitution enables high-speed data transmission without the traditional electrical signal delay problems.
2Reliability
If optical signals are used instead of electrical signals, then signal delay issues are avoided, but a combination of electrical chip and optical chip is required, complicating the design
Solution Approach 1:
The patent merges the electrical chip and optical chip into a single integrated optical module. The optical chip includes both the optical signal transmission components and the electrical signal processing components in one unified structure, eliminating the need for separate electrical and optical chips. This integration simplifies the overall system design while maintaining the benefits of optical signal transmission.
3Ease of manufacture
If the optical chip is bonded before forming molding material, then the molding process can be completed, but the bonding accuracy is affected by the molding material and process
Solution Approach 1:
The patent performs the optical chip bonding action before the molding process. By bonding the optical chip to the electrical chip first, the precise optical alignment is established before any molding material is applied. This preliminary bonding ensures that the optical components remain accurately aligned throughout subsequent molding and packaging operations, preventing any degradation of optical alignment accuracy.
4Area of stationary object
If a compact multichip module is achieved, then the footprint is reduced, but the molding requirements become more stringent
Solution Approach 1:
The patent inverts the traditional manufacturing sequence by bonding the optical chip before applying the molding material, rather than bonding after molding. This reversal of the process sequence allows for compact multichip module design while avoiding the stringent molding requirements that would otherwise be necessary to maintain optical alignment in tightly packed configurations.
Data Source
AI summary
A semiconductor device includes a first chip, a dielectric layer over the first chip, and a second chip over the dielectric layer. A conductive layer is embedded in the dielectric layer and is electrically coupled to the first chip and the second chip. The second chip includes an optical component. The first chip and the second chip are arranged on opposite sides of the dielectric layer in a thickness direction of the dielectric layer.