Semiconductor Optical Device Alignment via Adhesive Gel
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Solution Overview
Problem
Horizontal and vertical misalignment issues between light emitters and optical sensors in semiconductor device packages lead to inefficiencies in light transmission due to inconsistent cavity depths and manufacturing tolerances.
Innovation Solution
The semiconductor device package incorporates an optical device with a first portion extending into the substrate and a second portion extending along the substrate's surface, providing improved alignment and reduced optical coupling losses through strategic design and adhesive gel placement, allowing for enhanced horizontal and vertical maneuvering areas independent of manufacturing tolerances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the light emitter and optical sensor are placed in cavities with consistent depth, then vertical alignment is improved, but manufacturing complexity increases due to precise cavity depth control requirements
Solution Approach 1:
An adhesive gel layer is introduced as an intermediary between the optical device and the cavity bottom surface. This gel layer compensates for depth variations in the cavity, allowing the optical device to be positioned at the correct height regardless of cavity depth inconsistencies. The gel acts as a mediator that absorbs the manufacturing tolerances of the cavity while maintaining precise vertical alignment of the optical components.
2Measurement precision
If the cavity depth tolerance is reduced to improve vertical alignment, then alignment precision is improved, but manufacturing cost and difficulty increase
Solution Approach 1:
The invention changes the parameter of the adhesive gel layer thickness to compensate for cavity depth variations. By adjusting the gel layer thickness, the effective position of the optical device can be controlled independently of the cavity depth. This allows manufacturing with relaxed cavity depth tolerances while maintaining high alignment precision through gel layer parameter adjustment.
3Manufacturing precision
If the optical device extends beyond the substrate surface to facilitate alignment, then horizontal alignment is improved, but the device structure becomes more complex
Solution Approach 1:
The invention resolves horizontal alignment issues by transitioning from horizontal extension to vertical positioning. Instead of extending the optical device horizontally beyond the substrate surface, the solution positions the device vertically within the cavity at an appropriate depth, using the adhesive gel layer to maintain horizontal alignment. This dimensional shift eliminates the need for complex overhanging structures while achieving precise alignment.
Data Source
AI summary
A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.