Semiconductor Optical Inspection Position Adjustment
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Solution Overview
Problem
Conventional inspection methods for semiconductor devices with optical devices lack sufficient accuracy in measuring optical signal characteristics.
Innovation Solution
An inspection method and system that electrically connects the semiconductor device's electrical signal terminal to an electric connector and optically connects the optical signal terminal, using a probe card with connectors to adjust the position and inclination of the inspection object, measuring a test light output signal to determine optimal inspection conditions for improved accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional inspection method is used to measure optical device characteristics, then inspection process is simple, but measurement accuracy is insufficient
Solution Approach 1:
The patent applies preliminary action by performing position and inclination adjustment of the optical device before the actual inspection measurement. The inspection object is positioned and inclined preliminarily to optimize light signal reception, ensuring measurement accuracy is achieved before the main inspection process begins.
Solution Approach 2:
The patent implements feedback by using light signal intensity as a feedback parameter during position and inclination adjustment. The system measures the light signal output and uses this feedback to iteratively adjust the position and inclination until optimal signal strength is achieved, thereby ensuring measurement accuracy.
2Measurement precision
If position and inclination adjustment is performed to optimize light signal, then measurement accuracy is improved, but inspection time increases
Solution Approach 1:
The patent applies self-service by enabling the inspection system to automatically perform position and inclination adjustment using built-in light signal measurement capabilities. The system self-adjusts without requiring external intervention or complex additional equipment, reducing time loss while maintaining measurement accuracy.
Solution Approach 2:
The patent replaces complex mechanical positioning systems with an optical feedback-based adjustment mechanism. Instead of using precise mechanical positioning devices, the system uses light signal intensity as a guide for automatic position and inclination adjustment, simplifying the mechanical complexity and reducing inspection time.
3Reliability
If optical fiber is brought close to inspection object to acquire characteristics, then optical signal transmission is achieved, but measurement accuracy requirement is not ensured
Solution Approach 1:
The patent applies dynamics by making the position and inclination of the inspection object adjustable rather than fixed. The system dynamically adjusts position and inclination based on light signal feedback to optimize measurement conditions, ensuring both reliable optical signal transmission and high measurement accuracy.
Solution Approach 2:
The patent implements parameter changes by varying position and inclination parameters to optimize measurement conditions. By changing these geometric parameters and using light signal intensity as a feedback parameter, the system ensures both reliable optical coupling and high measurement accuracy are achieved simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method and system provide enhanced measurement accuracy for semiconductor devices with optical devices by ensuring the optical intensity of the test light output signal meets a predetermined determination value, thereby improving inspection precision.
Implementation Method 1
measuring a test light output signal output from a monitoring element provided in an inspection object in response to a test input signal
Implementation Method 2
optically connects an optical signal terminal of the semiconductor device to an optical connector
Data Source
AI summary
An inspection method includes a step S20 of electrically connecting electrical signal terminals of a semiconductor device to electric connectors, and optically connecting optical signal terminals of the semiconductor device to optical connectors, a step S30 of measuring a test light output signal output from a monitoring element provided in an inspection object in response to a test input signal having been input to the monitoring element while adjusting conditions of a position and an inclination of the inspection object, and extracting conditions in which an optical intensity of the test light output signal is a predetermined determination value or greater as inspection conditions, and a step S40 of inspecting the semiconductor device under the inspection conditions.