Semiconductor Package Optical Pillar Encapsulation
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Solution Overview
Problem
Existing semiconductor device packages face damage or pollution during manufacturing due to electrical areas being compromised during operations, necessitating an improved packaging solution that protects both optical and electrical components effectively.
Innovation Solution
A semiconductor device package design incorporating an optical conductive pillar, a first encapsulant of specific thickness, and a second encapsulant or wall of different thickness, along with a protection layer that encapsulates the optical conductive pillar and exposes the electrical area, utilizing materials like organic and inorganic compounds to form a step structure and reduce interference, thereby protecting the semiconductor device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a collimator is placed on each pixel, then optical performance is improved, but the electrical area becomes vulnerable to damage or pollution during manufacturing
Solution Approach 1:
The patent divides the protective structure into two distinct encapsulants with different thicknesses: a first encapsulant that protects the optical conductive pillar and a second encapsulant that protects the electrical area. This segmentation allows each region to receive appropriate protection while maintaining their respective functions.
Solution Approach 2:
The patent applies different encapsulant thicknesses to different regions of the semiconductor device. The first encapsulant has a greater thickness to protect the optical conductive pillar, while the second encapsulant has a lesser thickness to protect the electrical area, ensuring each region receives locally optimized protection.
2Ease of manufacture
If a uniform encapsulant thickness is used, then manufacturing is simplified, but optical performance and electrical protection are compromised
Solution Approach 1:
The manufacturing process is segmented into distinct steps: forming the first encapsulant with a greater thickness to protect the optical conductive pillar, then forming the second encapsulant with a lesser thickness to protect the electrical area. This segmented approach enables precise thickness control for each region.
Solution Approach 2:
The patent introduces thickness variation in the vertical dimension to differentiate protection levels for optical and electrical areas. By utilizing different thicknesses in the encapsulant structure, the patent achieves region-specific protection without complicating the manufacturing process.
3Productivity
If the electrical area is exposed, then manufacturing operations can proceed, but the electrical area is vulnerable to damage or pollution
Solution Approach 1:
The patent applies preliminary protective action by forming the first and second encapsulants before completing manufacturing operations. The encapsulants are formed in advance to protect the optical conductive pillar and electrical area, preventing damage or pollution during subsequent manufacturing steps.
Solution Approach 2:
The encapsulants serve as beforehand cushioning structures that protect the vulnerable optical and electrical areas from potential damage or pollution during manufacturing. The first encapsulant cushions the optical conductive pillar while the second encapsulant cushions the electrical area, ensuring their integrity throughout the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects the semiconductor device's optical and electrical areas, enhancing manufacturing reliability and optical performance by reducing cross-talk and allowing desired light transmission while maintaining electrical connectivity.
Implementation Method 1
allowing desired light transmission
Implementation Method 2
reducing cross-talk
Data Source
AI summary
A semiconductor device package includes a semiconductor device, an optical conductive pillar, a first encapsulant and a second encapsulant. The semiconductor device includes a pixel. The optical conductive pillar is disposed on the pixel. The first encapsulant has a first thickness and encapsulates the optical conductive pillar. The second encapsulant has a second thickness different from the first thickness.