Semiconductor Die Optical Routing Layer Integration
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Solution Overview
Problem
Existing semiconductor die packages require external optical components and repeater chips for high data bandwidths, leading to increased size, complexity, and power consumption due to the need for extensive electrical signal routing.
Innovation Solution
Integration of an optical routing layer on the semiconductor die with passivation materials of different refractive indices, forming passive optical components like waveguides and vertical coupling gratings, which enables optical I/O connections without external components, reducing the need for repeater chips and conductive metal in the data path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If discrete optical components are integrated side-by-side with the semiconductor die package on an interposer, then optical signal transmission capability is improved, but the overall assembly size and complexity increase
Solution Approach 1:
The patent merges the optical routing function directly into the semiconductor die package structure by forming optical routing layers within the passivation materials of the semiconductor die itself, rather than using separate discrete optical components on an interposer. This integration eliminates the need for external optical components while maintaining optical signal transmission capability, thereby reducing assembly complexity while preserving high-speed data transmission.
Solution Approach 2:
The passivation materials in the semiconductor die are given dual functionality: they continue to provide their traditional protective and insulating functions while simultaneously serving as optical routing layers for guiding optical signals. This multi-functionality eliminates the need for separate optical components and reduces overall assembly complexity while maintaining optical transmission capabilities.
2Reliability
If repeater chips are added to boost electrical signals at high data bandwidths, then signal strength is improved, but power consumption and cost increase
Solution Approach 1:
The patent replaces the electrical signal transmission system with an optical signal transmission system. By using optical routing layers formed in the passivation materials, optical signals can be transmitted directly over the semiconductor die without degradation, eliminating the need for repeater chips that would be required to boost electrical signals at high bandwidths. This substitution of optical for electrical transmission maintains signal integrity while reducing power consumption.
Solution Approach 2:
The patent transitions from electrical signal transmission (which requires repeater chips for signal boosting) to optical signal transmission through vertically integrated optical routing layers. This dimensional change in the transmission medium allows signals to propagate without the limitations of electrical transmission, eliminating the need for additional repeater chips and their associated power consumption.
3Reliability
If extensive conductive metal is used for electrical signal routing, then electrical connectivity is improved, but the amount of material and device complexity increase
Solution Approach 1:
The patent replaces the conductive metal electrical routing system with an optical routing system. The optical routing layers are formed within the existing passivation materials of the semiconductor die, eliminating the need for extensive conductive metal traces. This substitution maintains signal transmission capability while significantly reducing the quantity of conductive metal required.
4Speed
If external optical components are used for high bandwidth optical I/O, then optical transmission capability is improved, but package size increases
Solution Approach 1:
The patent combines the optical routing function directly into the semiconductor die package structure by forming optical routing layers within the passivation materials. This integration eliminates the need for separate external optical components, allowing high-bandwidth optical I/O capability to be achieved within the existing package footprint without increasing package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the efficiency of semiconductor die packages by eliminating the need for repeater chips and reducing the amount of conductive metal, thereby improving signal strength and integrity at high bandwidths without increasing the package size.
Implementation Method 1
an optical routing layer formed from passivation materials that are deposited around the exposed portions of TSVs during conventional semiconductor die manufacturing processes... The optical routing layer can include two or more passivation materials having different refractive indices
Implementation Method 2
The optical routing layer can include two or more passivation materials having different refractive indices that are patterned to form passive optical components such as optical waveguides and/or vertical coupling gratings
Data Source
AI summary
Semiconductor devices having optical routing layers, and associated systems and methods, are disclosed herein. In one embodiment, a method of manufacturing a semiconductor device includes forming conductive pads on a first side of a substrate and electrically coupled to conductive material of vias extending partially through the substrate. The method further includes removing material from a second side of the substrate so that the conductive material of the vias projects beyond the second side of the substrate to define projecting portions of the conductive material. The method also includes forming an optical routing layer on the second side of the substrate and at least partially around the projecting portions of the conductive material.