Semiconductor Optical Routing With Inclined Trench Waveguide
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Solution Overview
Problem
As integrated circuits (ICs) become smaller and faster, electrical signal delays due to capacitance, inductance, or resistance become a design concern, prompting the use of optical signals for data transmission, but existing approaches face limitations in wavelength range and substrate structure flexibility.
Innovation Solution
A semiconductor device with a substrate featuring a trench with an inclined sidewall, a reflective layer, and a grating structure that integrates optical routing and wavelength multiplexing/demultiplexing, allowing for low-profile, flexible operation across a wide range of wavelengths using a waveguide and optical components like lasers and photo-sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electrical signals are used for data transmission in ICs, then the device can operate at lower speeds, but signal delays due to capacitance, inductance, or resistance become a design concern at high speeds
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission. Optical signals use light photons instead of electrical electrons, eliminating the capacitance, inductance, and resistance issues that cause signal delays in electrical systems. This substitution enables high-speed data transmission without the traditional electrical signal delays.
2Adaptability or versatility
If traditional optical transmission approaches are used, then optical signals can be transmitted, but the wavelength range and substrate structure flexibility are limited
Solution Approach 1:
The patent introduces a three-dimensional grating structure with facets oriented at different angles relative to the substrate normal. This dimensional approach creates multiple optical paths and enables wavelength multiplexing/demultiplexing capabilities. The grating structure diffracts optical signals at different angles based on wavelength, providing adaptability across a wide wavelength range while maintaining substrate flexibility.
3Adaptability or versatility
If optical routing and wavelength multiplexing are integrated in a single substrate, then flexibility and operational range are improved, but the device requires precise alignment of multiple components
Solution Approach 1:
The patent combines optical routing, wavelength multiplexing, and demultiplexing functions into a single integrated substrate structure. The grating structure, waveguide, and reflective layer work together as a unified system, eliminating the need for separate alignment of multiple discrete components. This integration maintains manufacturing feasibility while achieving wide operational range and flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient optical signal routing and multiplexing/demultiplexing in a single substrate, offering greater flexibility and operational range compared to traditional approaches, particularly in visible and infrared light wavelengths, while avoiding signal delays.
Implementation Method 1
a grating structure over the substrate... configured to multiplex and/or demultiplex optical signals
Implementation Method 2
A reflective layer is over the inclined sidewall... configured to direct optical signals demuxed, or to be muxed, by the grating structure between the waveguide and external optical circuitry
Implementation Method 3
The waveguide is configured to guide optical signals between the grating structure and the reflective layer
Data Source
AI summary
A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.