Semiconductor Optical Device Scribe Line Formation
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Solution Overview
Problem
The existing methods for producing semiconductor optical devices face challenges in completely removing photosensitive BCB resin for forming scribe lines, leading to nonuniform exposure and reduced reliability due to metal-semiconductor reactions at depressed side surfaces of the ridge structure.
Innovation Solution
A method involving the use of a non-photosensitive resin region with separate openings for the ridge structure and scribe area, allowing for precise etching and formation of scribe lines without exposing the resin, using reactive ion etching with a mixed gas containing fluorocarbon and oxygen to achieve high precision and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If photosensitive BCB resin is used and exposed to form scribe lines, then scribe line formation is enabled, but nonuniform exposure occurs and metal-semiconductor reactions happen at depressed side surfaces
Solution Approach 1:
The patent divides the resin layer into two distinct regions: a photosensitive resin region covering the ridge structure and a non-photosensitive resin region covering the scribe line area. This segmentation allows each region to be processed independently - the photosensitive region can be exposed and developed to form openings for electrodes, while the non-photosensitive region remains intact to prevent unwanted reactions during scribe line formation, thereby resolving the contradiction between ease of manufacture and device reliability
Solution Approach 2:
The patent applies different properties to different parts of the resin layer by using photosensitive resin only where needed (on the ridge structure) and non-photosensitive resin in areas where exposure should be avoided (scribe line regions). This local differentiation ensures that exposure processes affect only the intended areas, preventing metal-semiconductor reactions at side surfaces while maintaining manufacturability
2Manufacturing precision
If exposure area is decreased to remove photosensitive BCB resin in scribe line region, then scribe line formation is improved, but shortage of exposure occurs and nonuniform distribution of exposure is caused
Solution Approach 1:
By segmenting the resin layer into photosensitive and non-photosensitive regions, the patent eliminates the need to decrease exposure area. The photomask can maintain full coverage of the wafer surface, ensuring uniform exposure distribution, while the non-photosensitive resin in scribe line regions simply does not react to exposure, naturally forming the desired scribe line pattern without compromising exposure uniformity
3Ease of manufacture
If photosensitive BCB resin is removed completely from scribe line region, then scribe line formation is achieved, but side surfaces of ridge structure become exposed and metal-semiconductor reactions occur
Solution Approach 1:
The patent applies non-photosensitive resin specifically to the scribe line regions while maintaining photosensitive resin on the ridge structures. During exposure and development, the photosensitive resin in scribe line areas is removed (enabling scribe line formation), but the non-photosensitive resin remains intact, providing continuous coverage and protection of the ridge structure side surfaces, thereby preventing metal-semiconductor reactions while achieving scribe line formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of semiconductor optical devices with improved reliability by preventing metal-semiconductor reactions and ensuring uniform exposure, allowing for precise scribe line formation and efficient separation of semiconductor laser bars.
Implementation Method 1
forming the scribe area by etching the non-photosensitive resin region using the first mask until the insulating film is exposed; forming an insulating layer by etching the insulating film using the non-photosensitive resin region as a mask
Data Source
AI summary
A method for producing a semiconductor optical device includes the steps of forming a semiconductor region including a ridge structure on a substrate; forming an insulating film on the semiconductor region; forming a non-photosensitive resin region on the insulating film, forming a first mask that defines a scribe area; forming the scribe area by etching using the first mask; after removing the first mask, forming an insulating layer by etching the insulating film, forming an electrode on the ridge structure and the non-photosensitive resin region to produce a substrate product; forming a scribe line on a surface of the semiconductor region in the scribe area of the substrate product; and cutting the product along the scribe line to form a semiconductor laser bar.