Semiconductor Device with Organic Substrate and Inverted Terminals
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Solution Overview
Problem
The existing semiconductor device manufacturing process is costly and complex due to the use of a silicon layer as a support layer, which requires expensive etching techniques and results in short-circuiting issues, and the high precision flip chip mounting process reduces manufacturing yield and increases costs.
Innovation Solution
A semiconductor device design where the first semiconductor element is mounted face-up on a support substrate, with external connection terminals and a connection electrode formed on the insulating material, allowing for a simplified manufacturing process and improved reliability by eliminating the need for through vias and reducing the risk of short-circuiting, while enabling high-density wiring and precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silicon layer is used as the support layer and through electrodes are formed using silicon etching or RIE, then the through electrodes can be formed to connect semiconductor elements, but the manufacturing cost increases and the process becomes complex
Solution Approach 1:
The patent extracts the support layer function from the silicon substrate and transfers it to an organic substrate. The silicon layer is removed entirely, and only the necessary wiring and electrode structures are retained on the organic substrate, simplifying the manufacturing process while maintaining connection reliability
Solution Approach 2:
The patent replaces the expensive silicon support layer with a cheaper organic substrate that serves the same structural and electrical support functions. The organic substrate is designed to be removed or dissolved after serving its purpose during manufacturing, reducing overall device cost and complexity
2Ease of manufacture
If conductor through holes are formed on the wiring member in advance and the support substrate is removed after mounting semiconductor elements, then the through electrodes can be exposed, but fine metal fragments scatter on the resin surface causing short-circuiting
Solution Approach 1:
The patent performs preliminary isolation of conductor through holes with insulating material before mounting semiconductor elements. This preliminary action prevents metal fragment contamination and short-circuiting during subsequent manufacturing steps, ensuring electrode reliability without complicating the process
Solution Approach 2:
The patent applies insulating material to cushion and protect the conductor through holes and metal fragments before they can cause short-circuiting. This protective layer acts as a barrier that prevents harmful interactions between metal fragments and conductive paths during the manufacturing process
3Reliability
If semiconductor elements are mounted on the electrode forming surface where solder balls are formed, then external connection terminals are established, but the height of solder balls must be increased and terminal pitch cannot be reduced
Solution Approach 1:
The patent separates the semiconductor element mounting surface from the external connection terminal forming surface. Semiconductor elements are mounted on one surface while external connection terminals are formed on the opposite surface, allowing independent optimization of both functions without interfering with each other's spatial requirements
Solution Approach 2:
The patent inverts the conventional approach by forming external connection terminals on the opposite surface to where semiconductor elements are mounted. This inversion allows the use of standard solder ball heights and enables finer terminal pitch without compromising connection reliability
4Manufacturing precision
If high precision flip chip mounting is conducted twice to mount semiconductor elements on opposite surfaces, then through electrodes can be arranged at fine pitch, but manufacturing yield decreases and time is increased
Solution Approach 1:
The patent performs preliminary formation of connection electrodes and wiring structures on the organic substrate before mounting semiconductor elements. This preliminary preparation simplifies subsequent mounting operations, reducing the need for repeated high-precision alignment and improving manufacturing efficiency
Solution Approach 2:
The patent extracts the complex dual-sided high-precision mounting process by using an organic substrate that allows for simplified electrode formation and connection. The organic substrate serves as a temporary platform that facilitates easier assembly and reduces the stringency of precision requirements
Data Source
AI summary
First semiconductor element 1 being buried in first insulating material 2; second semiconductor element 5 being covered by second insulating material 6; connection electrode 4 being buried in first insulating material 2 arranged between circuit surface of first semiconductor element 1 and circuit surface of second semiconductor element 5; external connection terminal 8 being arranged on lower surface of first insulating material 2 facing in the same direction as lower surface of first semiconductor element 1 opposite to circuit surface thereof; connection electrode 4 forming a part of path for electrically connecting circuit surface of first semiconductor element 1 and circuit surface of second semiconductor element 5 to each other; first semiconductor element 1 and external connection terminal 8 being electrically connected to each other by way of wire 3 and via 7 passing through region of insulating layer other than region thereof burying connection electrode 4.