Semiconductor Orientation Verification via Dedicated Conductive Paths
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Solution Overview
Problem
During semiconductor device testing, improper seating, misalignment, or orientation of the device relative to the contactor board can lead to incomplete electrical contact, resulting in spurious operation or damage, as the existing technologies lack effective methods to verify the proper relative orientation and electrical conductivity between the semiconductor device and the contactor board.
Innovation Solution
Incorporating designated electrically conductive paths on both the semiconductor device and the contactor board, which form a complete electrical circuit when properly aligned, allowing for verification through external electrical leads, ensuring proper orientation and conductivity by forming a continuous conductive path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the semiconductor device is mounted on the contactor board without orientation verification, then the mounting process is simple and fast, but improper orientation or misalignment may occur resulting in incomplete electrical contact and potential device damage
Solution Approach 1:
The patent applies preliminary action by incorporating dedicated electrically conductive paths during the design phase that will only complete circuit when the device is properly oriented. These paths are pre-configured in both the semiconductor device and contactor board, allowing orientation verification to be performed automatically during the mounting process without requiring additional verification steps.
Solution Approach 2:
The patent implements feedback by using the completion status of the electrically conductive paths as a verification mechanism. When the device is properly mounted, the conductive paths complete the circuit and provide feedback that confirms correct orientation and electrical contact, allowing immediate detection of improper mounting.
2Reliability
If orientation verification is performed using dedicated electrically conductive paths, then electrical contact reliability is improved, but the device and contactor board structure becomes more complex
Solution Approach 1:
The patent applies universality by designing the dedicated electrically conductive paths to serve multiple functions: they provide normal electrical connection for the device operation and simultaneously serve as orientation verification indicators. This multi-functionality eliminates the need for separate verification mechanisms, reducing overall system complexity while maintaining reliability.
Solution Approach 2:
The patent merges the orientation verification function with the existing electrical connection structure by integrating dedicated conductive paths into the standard contact patterns. This combination allows a single structural element to perform both electrical connection and orientation verification, avoiding the addition of separate verification components.
3Ease of operation
If the semiconductor device is tilted or misaligned, then only a portion of the electrically conductive elements make contact, but this condition is difficult to detect without additional verification mechanisms
Solution Approach 1:
The patent uses feedback from the electrically conductive paths to automatically detect alignment issues. When the device is tilted or misaligned, the conductive paths fail to complete the circuit, providing immediate electrical feedback that indicates improper orientation. This eliminates the need for visual inspection or additional measurement equipment.
Solution Approach 2:
The patent replaces mechanical inspection methods with electrical verification. Instead of requiring visual or physical detection of alignment, the system uses electrical conductivity measurement through the dedicated paths to detect misalignment, simplifying the detection process and making it automatically performable during mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable verification of the proper orientation and electrical conductivity between the semiconductor device and the contactor board, preventing damage and ensuring accurate testing by forming a continuous conductive path only when the components are correctly aligned, thus enhancing testing reliability and preventing financial losses.
Implementation Method 1
the semiconductor device includes at least one designated electrically conductive path, such that, when the semiconductor device and the contactor board are mounted together in a predetermined proper orientation, verification can be obtained that a complete electrical circuit is formed
Data Source
AI summary
A semiconductor device with a semiconductor die thereon and a contactor board are electrically coupled when the electrically conductive elements on the semiconductor device and the contactor board are in physical contact. A continuous electrically conductive path is formed with electrically conductive elements involving both the semiconductor device and the contactor board. A complete electrical circuit involving both the semiconductor device and the contactor board is formed only when the relative orientation of the semiconductor device and the contactor board have predetermined relationship and the electrically conductive elements of the two boards are in good physical contact.