Semiconductor Transport System with Overhead Gantry
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Solution Overview
Problem
Conventional substrate processing systems face inefficiencies and increased costs due to complex interface systems between material handling systems and processing tools, which hinder the flexible handling of wafer lots of varying sizes without impacting fabrication rates.
Innovation Solution
A modular and configurable transport system with overhead gantry configurations, including feeder robots and shuttle systems, that allows for flexible handling of wafer lots of any size by providing multiple move paths and fault tolerance, enabling continuous operation even with component failures, and maintaining constant transport rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional interface systems are used between material handling systems and processing tools, then substrate transport can be performed, but the system complexity increases and costs increase
Solution Approach 1:
The patent combines the material handling system interface and processing tool interface into a single integrated transport system. The carrier transport mechanism serves both functions simultaneously, eliminating the need for separate interface systems and reducing overall complexity while maintaining substrate transport capability.
Solution Approach 2:
The transport system is designed with universal carriers that can interface with multiple processing tools and material handling systems. The standardized carrier design and transport mechanism provide multi-functional capability, allowing the same system to perform various substrate transport operations without requiring tool-specific interface configurations.
2Productivity
If conventional interface systems are used between material handling systems and processing tools, then substrate transport can be performed, but costs increase
Solution Approach 1:
The transport system is divided into modular components including standardized carriers, transport modules, and interface elements that can be manufactured independently and assembled. This segmentation enables economies of scale in manufacturing and reduces overall system cost while maintaining substrate transport functionality.
Solution Approach 2:
The universal carrier design and standardized interface reduce the need for multiple specialized components, thereby reducing manufacturing costs. The same carrier and transport mechanism can serve multiple processing tools, eliminating redundant components and lowering overall system cost.
3Productivity
If conventional interface systems are used, then substrate transport can be performed, but flexibility in handling wafer lots of varying sizes is reduced
Solution Approach 1:
The transport system incorporates dynamic carrier configurations that can be adjusted to accommodate different wafer lot sizes. The carriers and transport mechanism are designed to be reconfigurable, allowing flexible adaptation to various substrate quantities and dimensions while maintaining efficient transport capability.
Solution Approach 2:
The system uses modular carriers that can be configured in different arrangements to handle varying wafer lot sizes. This segmentation allows the transport system to adapt to different production requirements without requiring complete system reconfiguration, thereby maintaining both productivity and flexibility.
4Productivity
If conventional interface systems are used, then substrate transport can be performed, but efficiency decreases
Solution Approach 1:
The transport system is designed to enable continuous substrate transport operations without interruption. The integrated carrier-based system allows for seamless transfer between material handling and processing tools, eliminating idle time and maintaining continuous productive action throughout the fabrication process.
Solution Approach 2:
By merging the interface functions into a single integrated transport system, the patent eliminates the time-consuming sequential operations of separate interface systems. The unified design allows simultaneous performance of loading and unloading operations, thereby reducing total cycle time and improving overall efficiency.
Data Source
AI summary
A semiconductor workpiece processing system including at least one substrate processing tool that has a common housing with a first side having a first substrate holding container interface and a second side having a second substrate holding container interface having a different orientation than the first substrate holding container interface, a first transport section disposed corresponding to the first side of the tool, a second transport section being separate and distinct from the first transport section and interfacing with the first transport section and being configured to transport the substrate holding container between the first transport section and the tool and between the first side and the second side of the tool, the second transport section including at least one overhead gantry disposed above the tool, where the second transfer section is capable of interfacing with at least the second substrate holding container interface.