Adaptor Structure for Semiconductor Package Testing
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Solution Overview
Problem
Existing test apparatuses for semiconductor packages require multiple adaptors of different sizes to accommodate various package sizes, leading to extended test times and potential damage during loading/unloading due to size mismatches.
Innovation Solution
An adaptable test apparatus with a main adaptor and movable sub-adaptors that can adjust to support semiconductor packages of different sizes, utilizing driving mechanisms and magnetic forces to securely position packages without collisions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple adaptors of different sizes are used to accommodate various semiconductor package sizes, then adaptability is improved, but device complexity and test time increase
Solution Approach 1:
The adaptor structure uses a single main adaptor body that can accommodate multiple semiconductor package sizes through movable sub-adaptors. The main adaptor includes a receiving space with movable first and second sub-adaptors that can be positioned to support different package dimensions, allowing one adaptor to perform the function of multiple fixed-size adaptors.
Solution Approach 2:
The adaptor structure employs movable sub-adaptors that can be repositioned within the main adaptor body. The first sub-adaptor is movable along the first direction, and the second sub-adaptor is movable along the second direction, allowing dynamic adjustment to match different semiconductor package sizes and shapes during the testing process.
2Device complexity
If a fixed-size adaptor is used, then device complexity is reduced, but adaptability to different package sizes deteriorates
Solution Approach 1:
The adaptor is segmented into a main adaptor body and separate movable sub-adaptors. The main adaptor body provides the structural framework, while the sub-adaptors are independent components that can be moved and repositioned. This segmentation allows the system to maintain structural simplicity while achieving adaptability through the movable components.
3Productivity
If the correctly sized adaptor is not used, then loading/unloading speed may be maintained, but damage to semiconductor package and socket occurs
Solution Approach 1:
The movable sub-adaptors are positioned in advance to match the specific semiconductor package being tested. Before the package is loaded, the sub-adaptors are adjusted to the correct position to provide proper support and guidance, preventing collision and damage during the loading process while maintaining efficient throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient testing of semiconductor packages of varying sizes without the need for multiple adaptors, reducing test time and preventing damage by ensuring secure and collision-free loading/unloading.
Implementation Method 1
utilizing driving mechanisms and magnetic forces to securely position packages without collisions
Data Source
AI summary
An adaptor structure includes a main adaptor, a first sub-adaptor, a second sub-adaptor and a first driving mechanism. The main adaptor is over a socket. The main adaptor has an opening. The first sub-adaptor is movably received in the opening of the main adaptor in a first direction. The first sub-adaptor is configured to support a first side surface of the semiconductor package. The second sub-adaptor is movably received in the opening of the main adaptor in the first direction and a second direction. The second sub-adaptor faces the first sub-adaptor to support a second side surface of the semiconductor package. The first driving mechanism is configured to move the second sub-adaptor in the second direction. Thus, the adaptor structure can guide the semiconductor packages having different sizes to the socket.