Semiconductor Package Data Mask Address Mapping
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Solution Overview
Problem
In semiconductor packages, data mask address mapping differs between single die packages (SDP) and dual die packages (DDP), making it challenging to maintain consistent data mask addressing when transitioning from SDP to DDP configurations.
Innovation Solution
The implementation of mapping blocks with buffering, selection, and multiplexing units that allow for the same data mask address mapping as in a single die package to be retained in a dual die package configuration, using a controller to recognize and calculate different data mask mappings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If dual die package configuration is used to increase memory capacity from unit area, then the number of address pins can be decreased, but data mask address mapping becomes inconsistent compared to single die package
Solution Approach 1:
The patent introduces mapping blocks as intermediary components between the address pins and the memory cores. These mapping blocks include buffering units, selection units, and multiplexing units that act as mediators to translate and reconcile address signals across multiple dies, ensuring consistent data mask addressing despite the dual die configuration.
Solution Approach 2:
The patent segments the address mapping function into distinct modular units: buffering units for signal stabilization, selection units for die-specific address routing, and multiplexing units for data mask signal distribution. This segmentation allows each unit to handle specific aspects of the mapping complexity independently, making the overall system more manageable and maintainable.
2Quantity of substance
If two dies are stacked to increase capacity, then pin count can be reduced, but data mask mapping differentiation occurs between dies
Solution Approach 1:
The mapping blocks are designed with universal functionality to handle data mask addressing for both first and second dies through the same interface. The multiplexing units can dynamically route data mask signals to either die based on the active address, providing a unified addressing scheme that works consistently across multiple dies without requiring die-specific external control.
Solution Approach 2:
The patent implements dynamic address mapping where the selection units and multiplexing units can adaptively route signals based on real-time address conditions. This dynamic behavior allows the same address pins to correctly address different dies and different memory regions within dies, maintaining ease of operation despite the increased capacity.
Data Source
AI summary
A semiconductor package may include a first die and a second die disposed adjacent to the first die. The semiconductor package may include a plurality of pads configured for receiving and outputting data mask addresses. The semiconductor package may include mapping blocks configured to map data mask signals among the first die, the second die, and the plurality of pads in response to a received address.