Semiconductor Package Adhesion Layer for Delamination Resistance

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Solution Overview

Problem

The delamination of molding compound from the surface of semiconductor devices during fan-out package operations due to insufficient adhesion, which is exacerbated by plasma treatment that alters surface chemical properties and causes additional issues like temporary molding compound deterioration and overflow.

Innovation Solution

A semiconductor package structure with a conformally disposed adhesion strengthening layer on the side surface of a conductive pillar and active surface of the semiconductor device, which acts as a buffer layer between the encapsulant and the semiconductor device, preventing delamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If plasma treatment is performed on the surface of the device wafer or die to improve adhesion, then the adhesion between the surface and molding compound is improved by creating a roughened surface, but the surface chemical character is changed and additional issues occur such as temporary molding compound deterioration and overflow

Engineering Contradiction:

Improveadhesion between surface and molding compoundVSAvoidmolding compound deterioration and overflow

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

A silane-based adhesion strengthening layer is applied as an intermediary between the device wafer/die surface and the molding compound. This layer chemically bonds to both surfaces, providing strong adhesion without requiring plasma treatment that causes surface chemical changes and molding compound deterioration.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the adhesion mechanism from physical roughening (plasma treatment) to chemical bonding (silane-based layer). The silane layer undergoes hydrolysis and condensation reactions to form strong chemical bonds with the substrate and molding compound, providing reliable adhesion without the harmful effects of plasma treatment.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If plasma treatment is performed to create a roughened surface for better adhesion, then adhesion is improved, but stress generated during manufacturing processes still causes delamination

Engineering Contradiction:

Improveadhesion between surface and molding compoundVSAvoidsurface chemical character

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The invention transitions from physical surface modification (plasma roughening) to chemical surface modification (silane-based adhesion layer). The silane layer provides chemical bonding capability that maintains surface chemical stability while achieving strong adhesion, preventing delamination under manufacturing stress.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The adhesion strengthening layer is a composite structure containing silane-based polymers and inorganic fillers (such as colloidal silica). This composite provides both chemical bonding to the substrate and compatibility with the molding compound, creating a stable interface that resists delamination.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If no adhesion strengthening layer is used, then the manufacturing process is simpler, but the molding compound delaminates from the device wafer due to insufficient adhesion

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidadhesion between molding compound and device wafer

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The adhesion strengthening layer is applied in advance to the device wafer or die surface before molding. This preliminary action ensures strong adhesion is established before the molding compound is applied, preventing delamination without complicating the overall manufacturing process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The silane-based adhesion strengthening layer is applied as a liquid coating that self-levels and cures to form a uniform adhesion-promoting layer. This self-service characteristic simplifies the application process while ensuring reliable adhesion across the entire surface.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves yield and reliability of the semiconductor package by enhancing adhesion and preventing delamination, thus maintaining structural integrity during manufacturing processes.

Implementation Method 1

an adhesion strengthening layer conformally disposed on a side surface of a conductive pillar and an active surface of a semiconductor device

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS12506103B2Semiconductor package structure and method of manufacturing the same

Publication Date: 2025.12.23 ADVANCED SEMICON ENG INC

AI summary

A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.