Semiconductor Package Adhesion Promotion Layer
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Solution Overview
Problem
Encapsulated semiconductor packages are prone to cracking during solder reflow due to moisture accumulation and thermal expansion mismatches between materials, leading to the 'popcorn effect' and potential delamination, which is exacerbated in 'green' and 'robust' packages.
Innovation Solution
A semiconductor package with selectively activated surface regions and an adhesion promotion layer deposited on these regions, using chemical treatments to enhance the affinity for the adhesion promotion layer, preventing moisture accumulation and improving thermal expansion compatibility between materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an additional adhesion promotion coating is provided on the encapsulated elements, then adhesion between materials is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The semiconductor component surfaces are selectively activated before the adhesion promotion layer is applied. This preliminary activation creates a more reactive surface that enhances subsequent adhesion layer bonding, thereby improving material adhesion while maintaining a streamlined manufacturing process without requiring additional complex steps
2Adaptability or versatility
If the package uses non-leaded solder for green packages, then environmental compatibility is improved, but cracking during solder reflow worsens due to higher reflow temperature
Solution Approach 1:
An adhesion promotion layer is applied beforehand to the semiconductor component surfaces before encapsulation. This layer acts as a cushioning interface that compensates for the thermal stress and cracking that occurs during high-temperature solder reflow, thereby maintaining reliability in environmentally compatible green packages
3Adaptability or versatility
If the package is designed for robust applications with extreme operating conditions, then operational reliability is improved, but susceptibility to popcorn effect and cracking worsens
Solution Approach 1:
A composite structure is created by combining the semiconductor component with an adhesion promotion layer and encapsulation material. This composite construction provides enhanced mechanical strength and moisture barrier properties, enabling the package to withstand extreme operating conditions while resisting the popcorn effect and cracking
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces cracking and improves moisture resistance and reliability during solder reflow, ensuring the semiconductor package's integrity and performance, especially in extreme conditions.
Implementation Method 1
Surface regions of the semiconductor component are selectively activated
Implementation Method 2
an adhesion promotion layer is disposed on at least areas of the semiconductor component
Implementation Method 3
a plastic encapsulation material encapsulates at least the semiconductor chip, the plurality of electrical connections, and the plurality of inner contact pads
Data Source
AI summary
A semiconductor package includes a semiconductor component including a circuit carrier with a plurality of inner contact pads, a semiconductor chip, and a plurality of electrical connections. An adhesion promotion layer is disposed on at least areas of the semiconductor component and a plastic encapsulation material encapsulates at least the semiconductor chip, the plurality of electrical connections and the plurality of the inner contact pads. Surface regions of the semiconductor component are selectively activated.