Semiconductor Package Adhesive Residue for Die Edge Reliability

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Solution Overview

Problem

Semiconductor packages face issues with die crack and delamination during testing, primarily due to discontinuities between the semiconductor device and the encapsulating material.

Innovation Solution

A semiconductor package structure is developed with a continuous adhesive residue that fills and connects the discontinuous surface between the back surface of the semiconductor device and the encapsulating material, using an anisotropic etching process to partially remove the adhesive layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a traditional semiconductor package structure is used with direct bonding between semiconductor device and encapsulating material, then the manufacturing process is simpler, but die crack and delamination occur at die edges during testing

Engineering Contradiction:

Improvedie crack and delamination resistanceVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

An adhesive residue layer is introduced as an intermediary between the semiconductor device and the encapsulating material. This adhesive residue fills the discontinuous surface at the die edges, creating a transition zone that bridges the gap between the two materials and prevents stress concentration that would otherwise cause die crack and delamination.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The adhesive residue is applied in advance to the discontinuous surface before final encapsulation, creating a protective cushioning layer that anticipates and prevents future die crack and delamination issues during testing and operation.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Manufacturing precision

If complex grinding processes are used to prepare the semiconductor device surface, then bonding accuracy improves, but manufacturing cost and process complexity increase

Engineering Contradiction:

Improvebonding surface accuracyVSAvoidmanufacturing process simplicity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

Instead of using complex grinding processes to achieve precise bonding surfaces, the invention changes the approach by applying an adhesive residue that can accommodate surface variations. This parameter change from mechanical precision to chemical adaptation simplifies the manufacturing process while maintaining effective bonding.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The adhesive residue acts as a consumable material that compensates for surface imperfections, eliminating the need for expensive and time-consuming grinding processes. The adhesive residue is applied directly and cured, providing a cost-effective alternative to mechanical surface preparation.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces or avoids die crack and delamination issues at die edges, simplifies the manufacturing process, and lowers production costs by eliminating the need for complex grinding processes.

Implementation Method 1

The adhesive layer is partially removed by anisotropic etching process to form an adhesive residue

Methodology Applied

Scientific EffectAnisotropic etching:

Data Source

PatentUS20250191990A1Manufacturing method of semiconductor package

Publication Date: 2025.06.12 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A manufacturing method of a semiconductor package includes the following steps. A semiconductor device is attached to a carrier by an adhesive layer on the carrier. The semiconductor device is encapsulated by an encapsulating material. A redistribution structure is provided over the semiconductor device and the encapsulating material. The carrier is removed. The adhesive layer is partially removed by anisotropic etching process to form an adhesive residue, wherein the adhesive residue at least reveals a back surface of the semiconductor device and at least partially covers the encapsulating material.