Semiconductor Package Air-Gap Housing for Lower Surface Heat

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Solution Overview

Problem

Semiconductor packages face challenges in managing heat dissipation effectively, leading to potential overheating and user safety issues due to the direct contact between the molding layer and the housing, which restricts the reduction of surface temperature.

Innovation Solution

Incorporating an air gap between the molding layer and the housing, defined by the housing and a recess region of the molding layer, which reduces heat transfer from the semiconductor chip to the housing, thereby lowering the surface temperature of the housing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the molding layer is in direct contact with the housing, then the structural integrity and simplicity are improved, but the heat dissipation performance deteriorates due to heat transfer to the housing

Engineering Contradiction:

Improvehousing surface temperatureVSAvoidpackage structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The molding layer is segmented into two distinct regions: a first molding region that contacts the housing and a second molding region that does not contact the housing. This segmentation allows the package to maintain structural integrity while creating thermal isolation, as the non-contacting second molding region acts as a thermal barrier between the heat-generating semiconductor chip and the housing.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The second molding region serves as an intermediary thermal barrier between the semiconductor chip and the housing. By positioning this molding region to not contact the housing, it mediates the heat transfer path, reducing the amount of heat reaching the housing surface while maintaining the overall structural simplicity of the package.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Loss of energy

If the molding layer contacts the housing, then the manufacturing process is simplified, but heat transfer from the semiconductor chip to the housing increases

Engineering Contradiction:

Improveheat transfer to housingVSAvoidmolding process complexity

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The molding layer is divided into a first molding region and a second molding region with different contact characteristics. The first molding region contacts the housing for structural support, while the second molding region is positioned to not contact the housing, creating a thermal break. This segmentation can be achieved through conventional molding techniques by designing appropriate mold cavities, maintaining ease of manufacture.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the molding layer are given different functional qualities: the first molding region provides structural support and thermal conduction to the housing, while the second molding region provides thermal insulation by not contacting the housing. This local differentiation of properties allows the package to reduce heat transfer to the housing while maintaining manufacturing simplicity through a single molding process.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The air gap effectively reduces the surface temperature of the housing, enhancing user safety and product satisfaction by minimizing heat transfer, while allowing for a compact and high-performance semiconductor package design.

Implementation Method 1

an air gap between the molding layer and the housing, defined by the housing and a recess region of the molding layer, which reduces heat transfer from the semiconductor chip to the housing

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS12191290B2Semiconductor package with recessed molding region disposed below housing and above semiconductor chip

Publication Date: 2025.01.07 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, the semiconductor chip including a logic chip and a memory stack structure on the logic chip, a connector and a connector terminal below the package substrate, a molding layer that covers the semiconductor chip, the molding layer having a recess region on a top surface of the molding layer, a housing that covers the molding layer, and an air gap on the semiconductor chip, the air gap being defined by the housing and the recess region of the molding layer, and the molding layer separating the air gap from the memory stack structure of the semiconductor chip.