Semiconductor Package Forced Airflow Heat Dissipation
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Solution Overview
Problem
Conventional heat dissipation methods for semiconductor packages in mobile devices are inadequate due to their small form factor, leading to insufficient heat dissipation from high-performance chips, which can result in malfunctioning due to heat-related deterioration.
Innovation Solution
A semiconductor package design that incorporates a circuit board with conductive wirings, an integrated circuit chip, a cover with openings for airflow, and an air flow generator, such as a rotary fan or piezoelectric blower, to create a compulsory airflow path for heat dissipation, enhancing thermal conductivity and convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional passive heat dissipation members are used, then the device structure is simple, but the heat dissipation capability is insufficient for small form factor mobile devices
Solution Approach 1:
The patent replaces the passive mechanical convection system with an active airflow generation system using a fan or blower. This mechanical substitution enables controlled forced convection, significantly improving heat dissipation capability while maintaining compatibility with small form factor mobile devices through integrated design
Solution Approach 2:
The heat dissipation structure is designed to serve multiple functions: the airflow path serves both cooling purposes and can be integrated with other device components. The cover structure simultaneously provides mechanical protection and defines the airflow channel, achieving multi-functionality that resolves the contradiction between simplicity and effectiveness
2Volume of moving object
If the device is downsized for small form factor, then the device size is reduced, but the heat dissipation surface area is decreased
Solution Approach 1:
The patent transitions from relying on two-dimensional surface area for heat dissipation to utilizing three-dimensional forced convection airflow paths. By creating vertical and horizontal airflow channels within the device housing, the system achieves effective heat removal without increasing the external surface area, thus resolving the contradiction between device downsizing and heat dissipation capability
Solution Approach 2:
The patent employs pneumatic principles by using forced air flow through carefully designed channels and openings. The airflow generator creates controlled air movement that efficiently carries heat away from the semiconductor chip, compensating for the reduced surface area available in compact mobile devices
3Productivity
If high performance chips are used, then the processing capability is improved, but the heat generation increases
Solution Approach 1:
The patent replaces passive thermal management with active forced convection using mechanical airflow generation. This substitution enables the system to handle the increased heat load from high-performance chips by providing controlled, high-velocity airflow that efficiently removes heat, thus supporting higher processing capabilities without thermal deterioration
Solution Approach 2:
The airflow generation system operates continuously or periodically to maintain constant heat removal from the chip. This continuous action ensures that heat is constantly dissipated as it is generated by the high-performance processor, preventing thermal accumulation and maintaining reliable operation under high load conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat from semiconductor packages by forced convection, improving thermal management and reducing the risk of malfunction in mobile devices, while minimizing the package's size and power consumption.
Implementation Method 1
an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow
Data Source
AI summary
A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.