Semiconductor Package Alignment Bonding for Accurate Chip Placement
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Solution Overview
Problem
Current semiconductor packaging processes face challenges with high-precision chip placement, leading to poor production efficiency, high equipment costs, and low positioning accuracy due to the slow speed of chip mounter machines.
Innovation Solution
A semiconductor packaging method involving the formation of alignment bonding parts on a carrier and interconnection devices, with alignment solder bumps and bonding pads, allowing for fusion bonding to achieve automatic alignment and fixation of semiconductor devices, reducing the need for precise placement and preventing shifting during molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a high-precision chip mounter is used for chip placement, then positioning accuracy is improved, but production efficiency deteriorates due to slow placement speed
Solution Approach 1:
Alignment bonding parts (solder bumps and bonding pads) are pre-formed on the carrier and interconnection devices before chip placement. This preliminary preparation enables automatic alignment during the bonding process, eliminating the need for high-precision placement equipment while maintaining accurate positioning.
Solution Approach 2:
The alignment bonding parts perform dual functions: they provide electrical connection and automatically align the semiconductor devices during fusion bonding. The solder bumps and bonding pads self-align through the bonding process itself, making the system self-correcting and independent of external high-precision placement equipment.
2Manufacturing precision
If a high-precision chip mounter is used for chip placement, then positioning accuracy is improved, but equipment cost deteriorates
Solution Approach 1:
The alignment bonding parts perform dual functions: they provide electrical connection and automatically align the semiconductor devices during fusion bonding. The solder bumps and bonding pads self-align through the bonding process itself, making the system self-correcting and independent of external high-precision placement equipment.
Solution Approach 2:
The patent replaces the mechanical precision system of high-precision chip mounters with a thermal-field-based fusion bonding system. Instead of relying on mechanical positioning accuracy, the system uses controlled heating and material flow during bonding to achieve automatic alignment, substituting complex mechanical precision equipment with a simpler thermal processing system.
3Productivity
If traditional chip placement methods are used, then production efficiency is maintained, but positioning accuracy deteriorates
Solution Approach 1:
Alignment bonding parts (solder bumps and bonding pads) are pre-formed on the carrier and interconnection devices before chip placement. This preliminary preparation enables automatic alignment during the bonding process, eliminating the need for high-precision placement equipment while maintaining accurate positioning.
Solution Approach 2:
The alignment bonding parts perform dual functions: they provide electrical connection and automatically align the semiconductor devices during fusion bonding. The solder bumps and bonding pads self-align through the bonding process itself, making the system self-correcting and independent of external high-precision placement equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the yield and efficiency of the semiconductor packaging process by allowing for accurate alignment and fixation of semiconductor devices, reducing the requirement for precise placement and lowering process costs.
Implementation Method 1
aligning and connecting a portion of the third alignment bonding parts with the first alignment bonding parts and aligning and connecting the remaining third alignment bonding parts with the second alignment bonding parts by fusion bonding
Implementation Method 2
heating the alignment solder bumps, so that the alignment solder bumps are at least partially in a molten state
Data Source
AI summary
Disclosed are a semiconductor packaging method, a semiconductor component and an electronic device. The semiconductor packaging method comprises: forming first alignment bonding parts at first target positions on a carrier, and attaching interconnection devices to second target positions of the carrier, each of the interconnection devices having second alignment bonding parts formed on a side of the interconnection device facing away from the carrier. The method further comprises: aligning and connecting a portion of the third alignment bonding parts of an active surface of a respective semiconductor device with corresponding ones of the first alignment bonding parts, and aligning and connecting the remaining third alignment bonding parts of the active surface of the respective semiconductor device with corresponding ones of the second alignment bonding parts by fusion bonding. Bonding with the alignment bonding parts prevent the semiconductor device from shifting and rotating in a subsequent molding process, thereby improving the yield of the semiconductor packaging process.