Semiconductor Package Antenna Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor package devices face challenges in reducing size while maintaining signal quality due to separate manufacturing of antennas and communication modules, leading to increased costs and longer RF signal transmission paths.
Innovation Solution
A semiconductor package device design that integrates a substrate with a first antenna array on its surface and a second antenna array on its lateral surfaces, along with a package body that encapsulates electronic components, allowing for increased antenna placement without increasing device size, using metal strips and layers for electrical connections to enhance signal gain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the antenna and communication module are separately manufactured and placed on different parts of the circuit board, then each component can be independently optimized, but the device size increases and manufacturing costs increase
Solution Approach 1:
The patent merges the antenna and communication module into a single integrated package device. The antenna is disposed on the circuit board while the communication module is packaged within a package body that is also disposed on the same circuit board, creating a unified structure that reduces overall device size while maintaining independent optimization capabilities through separate manufacturing followed by integration.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by disposing the antenna on the circuit board surface and the package body containing the communication module in a vertical or lateral configuration. This dimensional approach allows both components to coexist in a compact footprint, effectively reducing the two-dimensional area occupied while maintaining functional separation.
2Adaptability or versatility
If the antenna and communication module are separately manufactured and electrically connected after placement, then manufacturing flexibility is maintained, but separate manufacturing costs are incurred
Solution Approach 1:
The patent applies preliminary action by pre-manufacturing the antenna and communication module separately with their respective connection interfaces prepared in advance. The antenna is fabricated with connection pads on the circuit board, and the communication module is packaged with corresponding connection structures, enabling subsequent straightforward electrical connection through established processes such as wire bonding or soldering, thus maintaining flexibility while controlling costs.
3Area of stationary object
If the antenna and communication module are placed far apart on the circuit board, then each component has sufficient space, but the RF signal transmission path becomes long and signal quality deteriorates
Solution Approach 1:
The patent merges the antenna and communication module into a closely integrated package structure where both components are disposed on the same circuit board in proximity to each other. This spatial merging significantly shortens the RF signal transmission path between the antenna elements and the communication module, thereby improving signal quality and reliability while still providing adequate space for both components through efficient layout design.
Data Source
AI summary
The present disclosure provides for a semiconductor package device. The semiconductor package device includes a substrate, a first antenna, an electronic component, a package body and a second antenna. The substrate includes a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The first antenna is disposed on the first surface of the substrate. The electronic component is disposed on the second surface of the substrate. The package body is disposed on the second surface of the substrate and encapsulates the electronic component. The package body has a first lateral surface substantially coplanar with the first lateral surface of the substrate. The second antenna is disposed on the first lateral surface of the substrate and on the first lateral surface of the package body.