Semiconductor Package Antenna Using Conductor for Heat and Gain
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Solution Overview
Problem
Current semiconductor package devices face challenges in achieving high frequency wireless transmission with large gain and stable heat dissipation, particularly for applications like cell phones and vehicle radars, where antenna size, transmission quality, and heat management are critical.
Innovation Solution
A semiconductor package device design featuring a substrate with an antenna surrounded by a conductor that serves as both an electromagnetic-reflective and thermal dissipation surface, integrated with an electronic component and a feeding element within the substrate for improved radiation efficiency and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna size is increased to improve transmission quality and gain, then the radiation efficiency is improved, but the device volume increases
Solution Approach 1:
The patent utilizes the package cavity volume in the third dimension to place the antenna, transitioning from a two-dimensional surface mounting to a three-dimensional space utilization. This allows the antenna to achieve sufficient radiation area and gain without increasing the planar footprint of the device, effectively resolving the contradiction between transmission quality and device volume.
Solution Approach 2:
The antenna is nested within the package body cavity, utilizing the internal space of the semiconductor package structure. This nesting approach allows the antenna to be integrated within the existing device boundaries, achieving improved radiation efficiency without expanding the overall device volume.
2Speed
If high frequency wireless transmission is implemented to improve data rate, then the transmission speed is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces a thermal management structure as an intermediary between the high-frequency transmission components and the package environment. This structure facilitates heat transfer and dissipation, enabling high-frequency operation (28 GHz or 60 GHz) to proceed without excessive temperature rise, thus resolving the contradiction between transmission speed and heat dissipation.
3Reliability
If antenna gain is increased to improve transmission distance, then the radiation efficiency is improved, but the antenna size must be increased
Solution Approach 1:
The patent achieves increased antenna gain and transmission distance by utilizing the vertical space within the package cavity rather than expanding the horizontal antenna area. This three-dimensional configuration allows the antenna to achieve sufficient radiation efficiency and gain for extended transmission distance without increasing the planar antenna area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances radiation efficiency and heat dissipation, addressing the need for high-frequency wireless transmission with increased gain and stability in semiconductor package devices.
Implementation Method 1
the conductor is an electromagnetic-reflective surface
Implementation Method 2
the conductor is a thermal dissipation surface
Data Source
AI summary
A semiconductor package device includes a substrate having an upper surface; an antenna disposed on the upper surface of the substrate; a conductor disposed on the upper surface of the substrate and surrounding the antenna; and a package body covering the conductor and the upper surface of the substrate.