Antenna Integration in Semiconductor Package with Metal Frame
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Solution Overview
Problem
Existing semiconductor package devices face challenges in reducing size and signal quality due to separate manufacturing of antennas and communication modules, leading to increased costs and longer RF signal transmission paths.
Innovation Solution
A semiconductor package device with a substrate, electronic component, metal frame, and antenna, where the antenna is electrically isolated from the metal frame and connected to the substrate through a conductive contact, reducing the overall size and signal transmission distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the antenna and communication module are separately manufactured and placed on different parts of a circuit board, then each component can be manufactured independently, but the size of the wireless communication device increases and the RF signal transmission path becomes long
Solution Approach 1:
The patent merges the antenna and communication module into a single integrated semiconductor package device. The antenna is formed on the same substrate as the communication module components, eliminating the need for separate placement on different circuit board locations. This integration directly reduces the overall device size while maintaining independent manufacturability through semiconductor fabrication processes.
Solution Approach 2:
The antenna structure is nested within the same package footprint as the communication module. The antenna pattern is formed using conductive layers that are part of the substrate structure, effectively nesting the RF functionality within the existing package architecture rather than requiring additional external space.
2Ease of manufacture
If the antenna and communication module are separately manufactured and placed on different parts of a circuit board, then each component can be manufactured independently, but the RF signal transmission path becomes long causing signal quality degradation
Solution Approach 1:
By integrating the antenna and communication module in the same package, the RF signal transmission path is dramatically shortened. The antenna connects directly to the communication module through short trace connections on the same substrate, eliminating long transmission paths across the circuit board and reducing signal loss and interference.
3Strength
If the antenna is electrically connected to the metal frame, then the metal frame can provide structural support, but the antenna may experience electromagnetic interference or signal loss
Solution Approach 1:
The patent introduces an insulating layer as an intermediary between the antenna and metal frame. This dielectric barrier allows the metal frame to provide structural support while preventing direct electrical contact that would cause electromagnetic interference. The insulating layer acts as a mediator that maintains both mechanical strength and signal integrity.
Solution Approach 2:
The patent segments the electrical connection between the antenna and metal frame by introducing an insulating layer. This segmentation separates the structural function (metal frame) from the RF function (antenna), allowing each to operate independently without interference while maintaining necessary mechanical support.
Data Source
AI summary
The disclosure relates to a semiconductor package device. The semiconductor package device includes a substrate having a first surface and a second surface opposite to the first surface and including a first conductive contact. The semiconductor package device further includes an electronic component disposed on the first surface of the substrate. The semiconductor package device further includes a metal frame disposed on the first surface of the substrate. The semiconductor package device further includes an antenna disposed on the metal frame, wherein the antenna is electrically isolated from the metal frame and electrically connected to the first conductive contact of the substrate.