Integrated Semiconductor Package Antenna Isolation

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Solution Overview

Problem

Conventional semiconductor packages with antennas in wireless communication devices face high manufacturing costs and difficulties in achieving compact designs due to separate manufacturing and placement of antennas and wireless function circuits, which also lead to electromagnetic interference (EMI) and local oscillator (LO) leakage, making it challenging to achieve consistent wireless performance across different devices.

Innovation Solution

A semiconductor package that integrates a PCB antenna or conformal antenna with the wireless function circuit, using a substrate with pin pads, RF pads, semiconductor components, and mold compound, where the conductive solder is stacked between the RF pad and the PCB antenna's feeding structure, allowing for precise control of isolation and reduced LO leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the antenna and wireless function circuit are separately manufactured and placed on the system circuit board, then the manufacturing process is flexible and adaptable to different device configurations, but the manufacturing costs increase and the product design becomes less compact

Engineering Contradiction:

Improveadaptability to different device configurationsVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent combines the antenna and wireless function circuit into a single integrated semiconductor package. The antenna is formed on the mold compound of the package substrate, and the wireless function circuit is mounted on the same substrate, creating a unified module that reduces component count and simplifies manufacturing while maintaining adaptability through standardized package designs.

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If the antenna and wireless function circuit are separately manufactured and placed on the system circuit board, then different arrangements can be made for different devices, but it becomes more difficult to achieve compact product design

Engineering Contradiction:

Improvearrangement flexibilityVSAvoidproduct size

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The antenna and wireless function circuit are integrated into a single semiconductor package, significantly reducing the space required compared to separate placement on the system circuit board. This integration enables compact product design while the standardized package format allows adaptability across different device types.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If the antenna and wireless function circuit are separately placed on the system circuit board, then the components can be independently optimized, but electromagnetic interference and local oscillator leakage occur more easily

Engineering Contradiction:

Improvecomponent optimizationVSAvoidelectromagnetic interference

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The antenna and wireless function circuit are integrated into a single package with controlled internal layout and shielding structures. The package includes ground planes, shielding layers, and optimized trace routing that reduce electromagnetic interference and local oscillator leakage while maintaining the ability to independently optimize component performance through careful internal design.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The mold compound and package substrate act as intermediaries between the antenna and wireless function circuit, providing physical separation and electromagnetic shielding. The substrate layers include ground planes and shielding structures that mediate the electromagnetic fields and reduce interference between components.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Adaptability or versatility

If the system circuit board has different layer numbers, thicknesses, or materials for different wireless communication devices, then the design can be customized for each device, but the antenna and wireless component arrangement cannot be applied across different devices to achieve consistent wireless performance

Engineering Contradiction:

Improvedevice customizationVSAvoidconsistent wireless performance

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The semiconductor package is designed as a universal module that can be applied across different wireless communication devices. The integrated design with controlled internal geometry, substrate materials, and component placement ensures consistent wireless performance (such as antenna impedance, radiation pattern, and EMI characteristics) regardless of the host device's circuit board variations. The package self-contained design isolates the RF performance from external board variations.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS9691710B1Semiconductor package with antenna

Publication Date: 2017.06.27 CYNTEC

AI summary

A semiconductor package includes a substrate, a plurality of pin pads, a radio frequency (RF) pad, a semiconductor component, at least one surface mount device (SMD) component, a mold compound, a printed circuit board (PCB) antenna and a conductive solder. The RF pad is used to receive or transmit an RF signal on the top side of the substrate. The SMD component is mounted on the RF pad. The mold compound on the top side of the substrate covers the semiconductor component and the SMD component. The PCB antenna is located on the mold compound. Wherein, the conductive solder and the SMD component are stacked between the RF pad and a feeding structure of the PCB antenna.