Semiconductor Package Antenna Module Heat Dissipation
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Solution Overview
Problem
Semiconductor packages face challenges with increased signal transmission loss and ineffective heat dissipation due to the placement and interaction of semiconductor chips and passive components, which hinder the miniaturization and functionality of electronic devices.
Innovation Solution
A semiconductor package design that incorporates a frame with through-portions for semiconductor chips, a redistribution layer, passive components, and a heat dissipation structure, allowing for optimized signal transmission and heat dissipation by redistributing connection pads and integrating passive components above the chips, while the heat dissipation structure is connected to the metal layer for efficient heat discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips and passive components are mounted in a single package to achieve compactness and multifunctionality, then device integration and functionality are improved, but signal transmission loss increases and heat dissipation becomes less effective
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacking, placing passive components above semiconductor chips in the vertical dimension. This dimensional change reduces signal path length and interference while maintaining compact footprint, thereby reducing signal transmission loss despite increased integration density
Solution Approach 2:
The package is segmented into distinct functional layers: semiconductor chips at the base, connection members with redistribution layers for electrical interconnection, and passive components mounted above. This segmentation allows optimized signal routing and reduced interference between different component types, addressing the signal loss issue while maintaining multifunctionality
2Volume of moving object
If multiple semiconductor chips and passive components are mounted in a single package to achieve compactness, then device size is reduced, but heat dissipation effectiveness deteriorates
Solution Approach 1:
Connection members with heat dissipation pattern layers serve as thermal intermediaries between semiconductor chips and the package substrate. These intermediary structures provide dedicated thermal conduction paths that separate heat flow from signal paths, enabling effective heat dissipation despite the compact stacked arrangement
Solution Approach 2:
Heat dissipation is addressed by utilizing the vertical dimension through stacked layers with integrated heat dissipation structures. Thermal management is built into each layer of the three-dimensional package, allowing heat to be conducted away through multiple pathways in the vertical direction while maintaining small horizontal footprint
3Loss of energy
If connection pads are redistributed and passive components are integrated above chips to reduce signal loss, then signal transmission is improved, but manufacturing complexity increases
Solution Approach 1:
The connection member integrates multiple functions into a single structure: electrical connection between chips and passive components, signal routing through redistribution layers, and heat dissipation through patterned metal layers. This merging reduces the number of separate components and assembly steps, managing manufacturing complexity while achieving improved signal transmission
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces signal transmission loss and enhances heat dissipation, enabling more compact and efficient semiconductor packages that can be used in advanced electronic devices, such as antenna modules for 5G communications.
Implementation Method 1
a heat dissipation pattern layer, extending in a first direction, the other end of the heat dissipation pattern layer being connected to the heat dissipation structure
Data Source
AI summary
A semiconductor package includes a frame having first and second through-portions, first and second semiconductor chips, respectively in the first and second through-portions, each having a first surface, on which a connection pad is disposed, a first encapsulant covering at least a portion of the first and second semiconductor chips, a first connection member on the first and second semiconductor chips including a first redistribution layer electrically connected to the connection pads of the first and second semiconductor chips and a heat dissipation pattern layer, at least one passive component above the first semiconductor chip on the first connection member, and at least one heat dissipation structure above the second semiconductor chip on the first connection member and connected to the heat dissipation pattern layer.