Semiconductor Package Antenna Module Warpage Control
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Solution Overview
Problem
Existing semiconductor packaging technologies face challenges with warpage, overheating, and poor heat conductivity, leading to misalignment and weak bonding strength, especially when using fan-out wafer level packaging with radio frequency antennas, which require significant PCB area and result in inefficiencies.
Innovation Solution
A semiconductor package structure with a substrate, semiconductor chip, plastic packaging material layer, rewiring layer, metal bumps, and an antenna module, where a quartz or sapphire substrate is used to minimize warpage and enhance heat conductivity, and an adhesive film and dielectric layers improve bonding strength and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If plastic packaging material is used in fan-out wafer level packaging, then miniaturization and cost reduction are achieved, but warpage control becomes difficult and bonding strength decreases
Solution Approach 1:
The patent uses a composite structure combining plastic packaging material with a reinforcement layer (such as metal foil or rigid support layer) to maintain the miniaturization benefits of plastic packaging while providing sufficient mechanical strength and warpage control. This composite approach allows the packaging to remain small and cost-effective while achieving the required bonding strength for reliable component attachment.
2Adaptability or versatility
If antennas are laid out directly on PCB for radio frequency functions, then communication function is achieved, but PCB area is significantly increased
Solution Approach 1:
The patent integrates antennas directly into the packaging structure itself rather than laying them out on the PCB surface. By incorporating antenna elements into the packaging layers (such as using conductive traces in packaging substrates or embedded antenna structures), the radio frequency function is achieved within the vertical dimension of the package, thereby eliminating the need for additional PCB area while maintaining full RF functionality.
3Ease of manufacture
If conventional packaging materials are used, then packaging process is simple, but heat conductivity is poor leading to overheating
Solution Approach 1:
The patent employs composite packaging materials that combine conventional plastic packaging components with high thermal conductivity layers (such as metal heat spreaders, thermally conductive fillers, or heat sink integrations). This composite structure maintains the ease of manufacturing and packaging process simplicity associated with conventional materials while introducing enhanced heat conduction pathways to effectively manage thermal loads and prevent overheating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces warpage and overheating issues, enhances bonding strength, and improves heat conductivity, facilitating stable and efficient packaging with reduced volume and cost, suitable for mass production.
Implementation Method 1
a quartz or sapphire substrate is used to minimize warpage and enhance heat conductivity
Data Source
AI summary
A semiconductor package structure having an antenna module includes: a substrate, having a first surface and a second surface; a semiconductor chip, disposed on the first surface; a plastic packaging material layer, formed on the first surface, where the plastic packaging material layer wraps the semiconductor chip and exposes a part of a front surface of the semiconductor chip; a rewiring layer, disposed on the plastic packaging material layer and electrically connected to the semiconductor chip; a metal bump, electrically connected to the rewiring layer; and an antenna module, disposed on the second surface of the substrate.