Semiconductor Package Antenna EM Shield Integration
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Solution Overview
Problem
Wireless communication devices face challenges in achieving compact design and reducing electromagnetic interference (EMI) and local oscillator (LO) leakage due to separately manufactured antennas and wireless function circuits, which increase manufacturing costs and complicate layout considerations.
Innovation Solution
A semiconductor package integrating a radio frequency (RF) module, an antenna, and an electromagnetic (EM) shield with a mold body that fixes the antenna at a predetermined distance from the EM shield, allowing for compact design and improved shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If antenna and wireless function circuit are separately manufactured and disposed on different parts of system circuit board, then manufacturing flexibility is maintained, but manufacturing cost increases and product compactness deteriorates
Solution Approach 1:
The patent combines the antenna and wireless function circuit into a single integrated package component. The antenna is disposed on the lateral side of the RF module, and both are fixed together using a mold body, creating a unified assembly that reduces the number of separate components and simplifies the overall system architecture.
Solution Approach 2:
The antenna is positioned within the lateral space of the RF module package, effectively nesting the antenna structure within the overall package footprint. This nested arrangement allows both components to occupy overlapping or adjacent spaces efficiently, achieving compact integration without requiring separate board areas.
2Adaptability or versatility
If antenna and wireless function circuit are separately manufactured, then design flexibility is maintained, but layout complexity increases
Solution Approach 1:
By merging the antenna and wireless function circuit into one package, the patent eliminates the need for separate layout considerations for these two components. The integrated package is treated as a single unit during system layout, significantly reducing layout complexity while maintaining adaptability through the standardized package design.
3Object-generated harmful factors
If distance between antenna and wireless function circuit is increased to reduce LO leakage, then LO leakage is reduced, but device compactness deteriorates
Solution Approach 1:
The patent applies localized electromagnetic shielding by placing an EM shield between the antenna and RF module in specific regions where leakage occurs. This targeted approach provides effective LO leakage reduction at critical interfaces without requiring increased overall separation distance between the antenna and wireless function circuit.
Solution Approach 2:
The EM shield acts as an intermediary component positioned between the antenna and the RF module. This intermediate shielding structure blocks electromagnetic interference and LO leakage paths while allowing the antenna and circuit to remain in close proximity, thus maintaining device compactness while reducing harmful emissions.
4Object-affected harmful factors
If EM shield is placed between antenna and RF module to reduce EMI, then EMI shielding is improved, but device complexity increases
Solution Approach 1:
The EM shield is integrated into the same package structure as the antenna and RF module, combining multiple functions (shielding, mechanical support, spatial positioning) into a unified assembly. This integration reduces the number of separate components and simplifies the overall device structure while maintaining effective EMI shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, cost-effective semiconductor package that simplifies layout and reduces LO leakage by controlling the distance between the antenna and EM shield, enhancing shielding and impedance matching, and allowing direct mounting on system boards.
Implementation Method 1
an electromagnetic (EM) shield covering the RF module, wherein the EM shield includes a side wall disposed along the lateral side of the RF module, and the side wall of the EM shield is between the RF module and the antenna
Data Source
AI summary
A semiconductor package includes a radio frequency (RF) module, an antenna, an electromagnetic (EM) shield and a first mold body. The RF module having a bottom and a lateral side, wherein, the RF module includes a module board at the bottom. The antenna located at the lateral side of the RF module. The EM shield covering the RF module, wherein the EM shield includes a side wall disposed along the lateral side of the RF module, and the side wall of the EM shield is between the RF module and the antenna. The first mold body fixing the EM shield and the antenna, such that the antenna is spaced apart from the side wall of the EM shield by a predetermined distance.