Semiconductor Package Antenna Unit Millimeter Wave Signal Loss
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Solution Overview
Problem
Conventional semiconductor package structures degrade performance in the millimeter wave band due to manufacturing limitations, affecting high-speed and high-capacity data transmission in wireless communications.
Innovation Solution
A semiconductor package design featuring an antenna unit with a ground portion, radiating portion, and support portion, where the radiating portion is spaced apart from the ground portion with an empty space, and a connecting conductor to minimize signal loss, allowing efficient transmission and reception of radio signals in the millimeter wave band.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor package structures are used, then manufacturing is easier, but performance degrades in the millimeter wave band
Solution Approach 1:
The antenna unit is divided into separate functional portions: a ground portion, a radiating portion, and a support portion. These portions are spaced apart with empty space between them, allowing each to perform its specific function optimally in the millimeter wave band without the performance degradation associated with conventional integrated structures.
Solution Approach 2:
The patent transitions from planar antenna designs to a three-dimensional structure with vertical spacing between the ground portion, radiating portion, and support portion. This dimensional change enables better electromagnetic performance in the millimeter wave band by creating controlled empty space for signal propagation.
2Loss of energy
If the radiating portion is close to the ground portion, then the structure is more compact, but signal power loss increases
Solution Approach 1:
A support portion is introduced as an intermediary element between the ground portion and the radiating portion. This support structure maintains an optimal spacing that prevents signal power loss while managing the overall volume of the antenna unit. The support portion acts as a mediator that enables the necessary separation without compromising compactness.
3Object-generated harmful factors
If the antenna unit is integrated closely with the substrate, then manufacturing is simpler, but signal reflection increases
Solution Approach 1:
The antenna unit is segmented into distinct portions (ground, radiating, and support) that are spaced apart rather than integrated into a single close-proximity structure. This segmentation reduces signal reflection by preventing harmful interactions between adjacent antenna elements while maintaining manufacturability through modular construction.
4Productivity
If empty space is provided between radiating portion and ground portion, then transmission efficiency improves, but device complexity increases
Solution Approach 1:
The patent utilizes the vertical dimension to create empty space between the radiating portion and ground portion, rather than expanding the planar footprint. This three-dimensional approach improves transmission efficiency by allowing electromagnetic wave propagation while maintaining a compact overall structure that does not excessively increase device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances transmission and reception efficiency in the millimeter wave band by minimizing signal power loss and reducing reflectivity, thereby improving performance in high-frequency wireless communications.
Implementation Method 1
a radiating portion including one or more radiators disposed spaced apart from the ground portion
Implementation Method 2
at least a portion between the radiating portion and the ground portion is empty space
Data Source
AI summary
A semiconductor package includes a lower package including at least one electronic device, and an antenna unit disposed on an upper surface of the lower package, wherein the antenna unit includes: a ground portion disposed on an upper surface of the lower package, a radiating portion disposed to be spaced apart from the ground portion, and a support portion separating the radiating portion and the ground portion, and at least a portion between the radiating portion and the grounding portion is empty space.