Semiconductor Package Antistatic Layer via Metallic Epoxy Dip

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Solution Overview

Problem

Current semiconductor package technologies face challenges in enhancing mechanical and electrical reliability, particularly in shielding semiconductor chips from static electricity and electromagnetic interference, which can lead to malfunction and reduced reliability.

Innovation Solution

A method involving the formation of a semiconductor package by mounting semiconductor devices on a substrate, forming a molding member that covers the devices, sawing the molding member and substrate using a 'V'-shaped cutter to create a sloped profile, and applying a metallic epoxy material as an antistatic layer on the sawn surfaces to shield against static electricity and electromagnetic waves.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional coating methods are used to apply antistatic material, then the material can be applied to flat surfaces, but it cannot uniformly cover sloped sidewall surfaces created by V-shaped cutting

Engineering Contradiction:

Improveuniformity of antistatic layerVSAvoidcomplexity of coating process

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces conventional mechanical coating methods (brush, roller, or spray coating) with a dip-coating process. The entire molding member is immersed in a metallic epoxy material solution, allowing the material to uniformly coat all surfaces including sloped sidewalls through capillary action and gravity, eliminating the need for complex positioning and coating mechanism adjustments.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a metallic epoxy material as an intermediary substance that can flow and conform to complex geometries. This material acts as a mediator between the sloped surface geometry and the desired uniform coating, filling gaps and adhering to all surface types including vertical and inclined walls.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If V-shaped cutting blade is used to create sloped profile, then the molding member can be effectively separated, but the sidewall surfaces become difficult to coat uniformly

Engineering Contradiction:

Improveefficiency of package separationVSAvoiduniformity of antistatic layer coverage

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces complex multi-step coating processes with a simple dip-coating operation. The molding member with V-shaped cut surfaces is immersed in the metallic epoxy material, and the material naturally flows to cover all surfaces uniformly, maintaining both high productivity and coating uniformity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical state and application parameters of the coating material by using a low-viscosity metallic epoxy solution that can flow easily into and coat sloped surfaces. The material properties are optimized to ensure uniform coverage on complex geometries while maintaining efficient processing.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If ground patterns are sawn to expose sidewall surfaces, then electrical connection can be achieved, but the exposed surfaces require additional coating to prevent static electricity

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidnumber of additional coating steps

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the coating operation with the existing dip-coating process used for other package components. The ground pattern sidewalls are coated simultaneously with the molding member and substrate in the same metallic epoxy material bath, merging multiple coating functions into a single operation and avoiding additional process steps.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively forms a reliable semiconductor package with improved shielding against static electricity and electromagnetic interference, enhancing the mechanical and electrical reliability of the semiconductor devices.

Implementation Method 1

The metallic epoxy material may include a metallic material that shields the semiconductor devices from static electricity and electromagnetic wave signals.

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

spraying a metallic epoxy material on the sawn molding members using a sprayer to form an antistatic layer

Methodology Applied

Scientific EffectSpray deposition: Deposition (physical)

Data Source

PatentUS9524884B2Method of fabricating a semiconductor package

Publication Date: 2016.12.20 SAMSUNG ELECTRONICS CO LTD

AI summary

A method of fabricating a semiconductor package includes mounting a plurality of semiconductor devices on a substrate; forming a molding member that covers a top surface of the substrate, top surfaces of the semiconductor devices, and sidewall surfaces of the semiconductor devices; sawing the molding member and the substrate along pre-scribing lines of the substrate; and spraying a metallic epoxy material on the sawn molding members using a sprayer to form an antistatic layer on sidewall surfaces and a top surface of each of the sawn molding members.