Semiconductor Package Aperture Heat Dissipation Structure
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Solution Overview
Problem
2.5D/3D semiconductor packages face challenges in heat dissipation due to increased power consumption, which can lead to thermal management issues as the function and performance of chips improve.
Innovation Solution
Incorporating heat dissipation structures on both sides of the semiconductor device package, including heat sinks and thermal interface materials, to effectively transfer heat generated by electronic components outside the package, while using an encapsulant to cover and secure these structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the function and performance of the chip are improved, then the power consumption of the chip increases, but heat dissipation becomes a problem
Solution Approach 1:
The patent introduces heat dissipation structures on both the upper and lower sides of the semiconductor package, transitioning from single-sided to multi-dimensional heat dissipation. This allows heat to be dissipated in multiple directions simultaneously, effectively managing thermal loads generated by high-performance chips without compromising performance.
Solution Approach 2:
The patent employs thermal interface materials as intermediaries between the heat-generating electronic components and the heat dissipation structures. These materials facilitate efficient thermal transfer while electrically isolating components, enabling effective heat dissipation without interfering with the chip's electrical performance.
2Temperature
If heat dissipation structures are added to the package, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
The patent integrates heat dissipation structures with existing package substrates and encasement materials, merging thermal management functions into the structural framework of the package. This approach adds heat dissipation capability without proportionally increasing overall device complexity, as the thermal structures share space and materials with structural elements.
Solution Approach 2:
The package substrates and encasement materials serve dual purposes: providing structural support and electrical interconnection while simultaneously functioning as heat dissipation pathways. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby limiting the increase in device complexity.
3Temperature
If heat dissipation structures are incorporated into the package, then thermal management improves, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates heat dissipation structures during the package assembly process itself, rather than adding them as post-processing steps. Thermal interface materials are applied and heat dissipation structures are integrated while components are being assembled into the package, leveraging existing manufacturing workflows to minimize additional manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency, ensuring that the increased heat generated by high-power semiconductor components is effectively transferred and dissipated, thereby improving the thermal management of the semiconductor device package.
Implementation Method 1
a first heat dissipation structure extending through the aperture and attached to the second substrate
Implementation Method 2
heat dissipation structures on both sides of the semiconductor device package, including heat sinks
Implementation Method 3
a first thermal interface material (between the first heat dissipation structure and the set of components
Data Source
AI summary
A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate with a aperture, a second substrate disposed on the first substrate, a first electronic component disposed on the second substrate, an encapsulant disposed on the first substrate and covering the second substrate and a first heat dissipation structure extending through the aperture and attached to the second substrate.