Semiconductor Package Layout With Asymmetric Supporters
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Solution Overview
Problem
The miniaturization and increased functionality of semiconductor device packages lead to constraints on available area due to the presence of supporters or interposers, which occupy substrate space and limit the accommodation of electronic components.
Innovation Solution
The semiconductor device package design incorporates a reduced number of supporters arranged asymmetrically with respect to the geographic center of the carriers, and in some embodiments, the package is free of any supporters, with the encapsulant providing mechanical support instead.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If multiple supporters are used to interconnect substrates in multi-side stacking, then the stability and structural support of the semiconductor device package is improved, but the available area on the substrate for electronic components is reduced
Solution Approach 1:
The patent removes supporters from the substrate surface area by positioning them only at the periphery or eliminating them entirely in favor of encapsulant-based support. This extracts the supporters from the central substrate area, allowing maximum space for electronic components while maintaining package stability through alternative support mechanisms.
Solution Approach 2:
The encapsulant serves as a flexible supporting structure that replaces traditional rigid supporters. The encapsulant material provides mechanical support and stability throughout the package volume without occupying discrete substrate surface area, enabling both stability and maximum component accommodation.
2Stability of the object's composition
If supporters are positioned symmetrically on the substrate, then the structural balance and manufacturing alignment are improved, but the available area for electronic components is further constrained
Solution Approach 1:
The patent employs asymmetric positioning of supporters at the periphery of the substrate rather than symmetric distribution across the substrate surface. This asymmetric arrangement maintains structural balance for package stability while preserving central substrate area for electronic component placement, directly resolving the area constraint issue.
3Length of stationary object
If the package thickness is reduced for miniaturization, then the profile and size of the semiconductor device package is improved, but the structural support and stability may be compromised
Solution Approach 1:
The encapsulant acts as a continuous flexible support structure that provides structural integrity throughout the reduced package thickness. By distributing support forces through the encapsulant material rather than relying on discrete supporters, the package maintains stability even with minimized thickness for miniaturization goals.
Solution Approach 2:
The patent merges the support function with the encapsulant structure itself, combining mechanical support and protective encapsulation into a single integrated component. This eliminates the need for separate supporter elements that would increase thickness, achieving both miniaturization and structural support.
Data Source
AI summary
A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, an encapsulant, a second carrier and one or more supporters. The first carrier has a first surface and a first side contiguous with the first surface. The encapsulant is on the first surface of the first carrier, and the first side of the first carrier is exposed from the encapsulant. The second carrier is disposed over the first carrier. The one or more supporters are spaced apart from the first side of the first carrier and connected between the first carrier and the second carrier. The one or more supporters are arranged asymmetrically with respect to the geographic center of the first carrier. The one or more supporters are fully sealed in the encapsulant.