Embedded Identification Feature in Semiconductor Package Authentication
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Solution Overview
Problem
Semiconductor device manufacturers face challenges in verifying the authenticity of identifying information on packaged devices, as existing methods lack ease and effectiveness, especially after the device is mounted on a printed circuit board, and there are no non-destructive solutions to obtain and verify this information.
Innovation Solution
A method involving a semiconductor device with a carrier and conductive terminals, where a semiconductor die is encapsulated with an insulating mold compound, and a hidden identification feature on a metal structure is created using a data representation scheme, allowing for non-destructive verification using radiographic techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If visible identifying information is provided on the outside of a packaged semiconductor device, then the device can be easily identified, but the identifying information can be easily altered or counterfeited
Solution Approach 1:
The patent embeds identification features within the encapsulation material itself, nesting the authenticating information inside the package structure rather than on the exterior surface. This makes the identification information inaccessible to counterfeitors while remaining readable through the encapsulation material using radiographic techniques.
Solution Approach 2:
The patent introduces radiographic reading techniques as an intermediary method to access the identification information. Instead of direct visual inspection of exterior labels, the system uses radiographic waves to read through the encapsulation material, creating a secure intermediate layer that prevents tampering while enabling authentication.
2Reliability
If identification information is embedded within the encapsulation material, then counterfeiting is prevented, but non-destructive verification becomes challenging
Solution Approach 1:
The patent replaces mechanical or physical access methods (cutting, disassembly) with radiographic reading techniques. Instead of mechanically accessing the embedded identification features by opening the package, the system uses radiographic waves that can penetrate the encapsulation material to read the information non-destructively.
Solution Approach 2:
The patent changes the physical parameter used for reading the identification information from optical (visual inspection) to radiographic. This parameter change enables penetration through the encapsulation material while maintaining the ability to read the embedded features without destruction.
3Reliability
If the semiconductor die includes electrical functionality to verify authenticity, then verification capability is enhanced, but device complexity and cost increase
Solution Approach 1:
The patent extracts the authentication functionality from the semiconductor die itself and places it in the encapsulation material or carrier structure. This separation allows the die to remain simple while the authentication features are implemented in the packaging, which does not affect the die's electrical functionality or complexity.
Solution Approach 2:
The patent makes the encapsulation material serve multiple functions: protecting the semiconductor die and embedding authentication features. This multi-functionality eliminates the need for separate authentication components, reducing overall device complexity while maintaining verification capability.
4Reliability
If identification features are formed on metal structures encapsulated by mold compound, then authentication is enabled, but manufacturing precision requirements increase
Solution Approach 1:
The patent forms the identification features on the metal structures (such as lead frames or carriers) before the encapsulation process. This preliminary action allows the features to be created when the metal structure is more accessible and easier to work with, reducing the precision requirements compared to forming features after encapsulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective and non-destructive verification of the semiconductor device's authenticity by comparing the embedded information against predefined criteria, ensuring accurate identification without additional information needs, thus preventing counterfeiting.
Implementation Method 1
The semiconductor die is encapsulated with an electrically insulating mold compound
Implementation Method 2
obtaining information from the first identification feature through non-destructive examination of the packaged semiconductor device
Data Source
AI summary
A carrier having one or more conductive terminals is provided. A semiconductor die is mounted on the carrier. The semiconductor die is electrically connected to the one or more conductive terminals. The semiconductor die is encapsulated with an electrically insulating mold compound. A verification rule that tests whether inputted information satisfies authentication criteria is created. A first identification feature is formed on a metal structure that is encapsulated by the mold compound. The first identification feature comprises one or more symbols from a first data representation scheme that are covered by the mold compound. The one or more symbols of the first identification feature are selected to convey information that satisfies the authentication criteria of the verification rule.