Semiconductor Package Fixing Structure for Optical Axis Alignment
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Solution Overview
Problem
Existing semiconductor packages face challenges in accurately positioning optical components due to the lack of reference planes in the bonding process between circular fixing members and circular through-holes, leading to potential misalignment of the optical axis.
Innovation Solution
The semiconductor package design incorporates a fixing member with a first portion and a second portion, where the bond between them has a smallest thickness between linear portions, serving as reference planes for alignment, and the through-hole is shaped to accommodate the fixing member, enhancing joint strength and alignment precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If circular fixing members and circular through-holes are used for bonding, then the bonding process is simple, but the alignment precision of optical components deteriorates due to lack of reference planes
Solution Approach 1:
The patent introduces linear portions (flat surfaces) on the circular fixing member and corresponding linear portions on the through-hole wall. These asymmetric features break the rotational symmetry of the circular shape, creating unique reference planes that enable precise alignment. The linear portions serve as mating surfaces that define a specific orientation, preventing rotational misalignment while maintaining the overall circular form for ease of bonding.
2Ease of manufacture
If the bond thickness is uniform throughout, then the manufacturing process is simple, but the alignment precision of optical components deteriorates
Solution Approach 1:
The patent creates a non-uniform bond thickness distribution by designing the linear portions to be positioned such that the bond layer between the fixing member and through-hole wall is thinnest at these locations. This local variation in bond thickness creates precise reference planes for alignment. The linear portions act as spacing control features, ensuring consistent and accurate positioning of the fixing member relative to the through-hole, thereby improving optical axis alignment precision.
Data Source
AI summary
A semiconductor package includes a body, a fixing member, and a bond joining the body and the fixing member. The body includes a base and a frame including an inner side surface, an outer side surface, and an opening portion extending through the frame in a first direction. The fixing member includes a first portion located in the opening portion, a second portion continuous with the first portion and located on the outer side surface of the first portion, and a through-hole extending through the first portion and the second portion in the first direction. The bond is located between the first portion and the opening portion. The opening portion at least partially includes a first linear portion. The first portion includes a second linear portion facing the first linear portion. The bond has a smallest thickness between the first linear portion and the second linear portion.