Semiconductor Package Ball Land Insulation for Short Circuit Prevention

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Solution Overview

Problem

Conventional semiconductor packages face challenges in achieving high mounting density and reliability due to issues with solder ball durability and electrical connectivity, particularly in high-temperature and physical impact conditions, which can lead to short circuits and reduced solder joint reliability.

Innovation Solution

A semiconductor package design featuring a base substrate with semiconductor chips, bonding pads, connection terminals, ball lands, and insulating layers that connect ball lands while exposing specific areas, along with conductive wires that avoid direct contact with ball lands to prevent short circuits, and the use of solder balls for electrical and physical connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If solder balls are used to connect semiconductor chip to printed circuit board, then electrical connectivity and physical combination are achieved, but short circuits may occur under high-temperature and physical impact conditions

Engineering Contradiction:

Improvesolder joint reliabilityVSAvoidshort circuit risk under thermal and mechanical stress

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

An insulating layer is introduced as an intermediary between the conductive elements (connection terminals and ball lands). This insulating layer prevents direct contact between conductive paths that could cause short circuits, while still allowing the solder balls to perform their electrical and mechanical connection functions. The insulating layer acts as a mediator that isolates potential short circuit paths without interfering with the intended electrical connections.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The insulating layer is applied in advance to cover ball lands before solder balls are attached. This preemptive insulation protects against potential short circuits that may occur under thermal expansion or mechanical impact conditions, cushioning the system against harmful effects before they can manifest.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If ball lands are exposed for solder ball attachment, then electrical connectivity is achieved, but conductive wires may directly contact ball lands causing short circuits

Engineering Contradiction:

Improveelectrical connectivityVSAvoidshort circuit from conductive wire contact

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The insulating layer is selectively applied to cover specific ball lands (first ball land) while leaving other ball lands (second ball land) exposed. This local differentiation allows the patent to prevent short circuits at critical locations while maintaining electrical connectivity at required locations. The connection terminals are positioned to contact only the exposed ball lands, ensuring proper electrical connections without short circuits.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The insulating layer serves as a mediator between the conductive wire and the ball land, preventing direct contact that would cause short circuits. By placing this insulating intermediary at the interface between conductive elements, the patent eliminates the harmful short circuit effect while preserving necessary electrical connections through properly positioned terminals.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If high mounting density is achieved with solder balls on entire surface, then electronic characteristics are improved, but solder ball durability under physical impact is reduced

Engineering Contradiction:

Improvemounting densityVSAvoidsolder ball durability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The insulating layer is applied beforehand to protect ball lands and solder balls from mechanical impact and thermal stress. This cushioning layer absorbs and distributes stress, preventing damage to the solder balls and their connections under physical impact conditions, thereby improving durability without reducing mounting density.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS8828795B2Method of fabricating semiconductor package having substrate with solder ball connections

Publication Date: 2014.09.09 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package includes a base substrate, a semiconductor chip mounted on the base substrate and including bonding pads, first and second connection terminals disposed adjacent to the semiconductor chip on the base substrate and electrically connected to the bonding pads, a first ball land disposed on the base substrate and electrically connected to the first connection terminal, a second ball land spaced apart from the connection terminals, the first ball land disposed between the second ball land and at least one of the first and second connection terminals, a first insulating layer covering the first ball land but exposing at least a part of the second ball land, and a first conductive wire extending onto the first insulating layer and connecting the second connection terminal to the second ball land.