Semiconductor Package Ball Pad Electrode Design

The patent removes the uniting plate from the electrode structure, extracting the unnecessary component that caused manufacturing complexity. The electrodes are designed to function independently without requiring a uniting plate for structural integrity, thereby eliminating the time-consuming processes of connecting and subsequently removing the uniting plate.

Instead of uniting electrodes with a plate and then removing it, the patent inverts the approach by designing electrodes that function independently from the beginning. The electrodes are formed directly on the substrate without requiring a supporting uniting plate, reversing the conventional sequence of operations.

The patent replaces the electroplating process with a mechanical or direct deposition method. electrodes are formed by depositing conductive material directly onto the substrate using screen printing, paste application, or other direct deposition techniques, eliminating the need for photomasks and electroplating baths.

The patent eliminates the stainless steel supporting plate, using a disposable or sacrificial layer that is removed after electrode formation. This removes the need for expensive electroplating equipment and photomask materials, replacing them with simpler, cheaper materials that serve their purpose and are then discarded.

The patent extracts the uniting plate entirely from the design, eliminating the need for separation processes. electrodes are formed as independent structures from the beginning, so no removal or separation operation is required, directly eliminating the polishing or grinding step.

The patent performs the electrode separation action preliminarily by designing electrodes that are inherently separate and independent. Rather than starting with a united structure and separating it later, the electrodes are formed in their final separated state from the beginning, eliminating the need for subsequent separation operations.