Semiconductor Package Layout for Contamination-Free Biosensing
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Solution Overview
Problem
Semiconductor packages for medical applications face contamination issues due to the molded compound reacting with biological samples, affecting the accuracy of testing results.
Innovation Solution
The semiconductor package structure includes a die with a sensing region and a pad, where the distance from the sensing region to the pad is adjusted to prevent sample overflow from reaching the molded compound, and a microfluidic structure is used to direct samples to the sensing region, with the package design minimizing the use of molded compound and incorporating a protective structure to prevent contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a molded compound is used to encapsulate the die and conductive structure, then the package structure is protected and manufactured, but the molded compound reacts with biological samples causing sample contamination and affecting testing accuracy
Solution Approach 1:
The die surface is divided into distinct functional regions: a sensing region for biological sample detection, a pad region for electrical connection, and a barrier region separating them. The barrier region acts as a spatial partition that prevents sample overflow from reaching the pad and molded compound, thus eliminating contamination while maintaining package protection.
Solution Approach 2:
A barrier region is introduced as an intermediary zone between the sensing region and the pad/molded compound. This barrier serves as a protective mediator that blocks the harmful interaction between biological samples and the molded compound, preventing chemical reactions and contamination.
2Productivity
If the sensing region is positioned close to the first edge of the die, then the microfluidic structure can efficiently direct samples to the sensing region, but sample overflow may reach the pad and molded compound causing contamination
Solution Approach 1:
The die surface is segmented into functionally distinct regions with clear spatial separation. The sensing region is positioned adjacent to the first edge for efficient sample access, while the barrier region and pad region are positioned away from the first edge. This segmentation allows the sensing region to be close to the edge for productivity while the barrier prevents contamination.
Solution Approach 2:
Different regions of the die surface are assigned different functional qualities: the sensing region has high permeability to samples for efficient detection, while the barrier region has impermeability to samples for contamination prevention. This local differentiation of properties allows the system to achieve both efficient sample detection and contamination protection.
3Reliability
If the distance from the sensing region to the pad is increased to prevent contamination, then sample overflow is prevented, but the electrical connection between the die and substrate becomes more complex
Solution Approach 1:
The die surface is segmented such that the pad region is spatially separated from the sensing region by the barrier region. This segmentation naturally increases the distance between sensing and pad areas, preventing sample overflow from reaching the pad while organizing the electrical connection structure in a systematic manner.
Solution Approach 2:
The barrier region serves as an intermediary zone that physically separates the sensing region from the pad region. This intermediary structure prevents direct sample contact between the sensing area and electrical connection area, eliminating contamination risks while maintaining organized electrical connections through the substrate.
4Reliability
If a protective structure is added to cover the pad and conductive structure, then contamination is prevented, but the device complexity and manufacturing steps increase
Solution Approach 1:
The barrier region is merged with the die structure itself, forming an integrated part of the die surface rather than a separate protective component. This merging approach provides contamination protection while avoiding the additional complexity of separate protective structures, as the barrier is formed as part of the die fabrication process.
Solution Approach 2:
The die structure itself provides protection through its own integrated barrier region, eliminating the need for external protective structures. The barrier region serves the dual function of enabling sample access to the sensing region while simultaneously protecting the pad and conductive structures from contamination, making the system self-protecting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the risk of sample contamination and manufacturing costs by ensuring the molded compound is not exposed to the sample, thereby enhancing the accuracy of testing results and simplifying the manufacturing process.
Implementation Method 1
The microfluidic component allows a biological sample to enter a sensing region of the biochip
Implementation Method 2
carrying out ultrasonic welding to bond the microfluidic structure to the semiconductor package structure
Data Source
AI summary
A semiconductor package structure includes a substrate, a die and a conductive structure. The die is disposed on or within the substrate. The die has a first surface facing away from the substrate and includes a sensing region and a pad at the first surface of the die. The first surface of the die has a first edge and a second edge opposite to the first edge. The sensing region is disposed adjacent to the first edge. The pad is disposed away from the first edge. The conductive structure electrically connects the pad and the substrate. The sensing region has a first end distal to the first edge of the first surface of the die. A distance from the first end of the sensing region to a center of the pad is equal to or greater than a distance from the first end of the sensing region to the first edge of the first surface of the die.