Semiconductor Package Blocking Structure for EMI Shielding Control
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Solution Overview
Problem
Existing semiconductor packages face issues with electromagnetic interference (EMI) shielding, where backspill and burrs can occur during the formation of the shielding film, leading to reduced reliability and increased process costs.
Innovation Solution
Incorporating a blocking element, such as a dam structure or trench structure, on the insulating layer to prevent the backspill of the shielding layer from contacting the connection conductors, thereby enhancing the reliability of the semiconductor package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an EMI shielding film is formed on the insulating layer structure, then electromagnetic interference shielding is improved, but backspill and burrs occur during the forming process
Solution Approach 1:
A blocking element (dam structure or trench structure) is formed on the insulating layer structure before the EMI shielding film is deposited. This preliminary structural preparation prevents the shielding material from forming backspill and burrs during the deposition process by providing a physical barrier that controls material flow and accumulation.
Solution Approach 2:
The blocking element acts as an intermediary structure between the insulating layer and the EMI shielding film. It mediates the deposition process by controlling where the shielding material can and cannot accumulate, thereby preventing harmful backspill and burr formation while still allowing effective EMI shielding.
2Object-affected harmful factors
If the shielding layer is formed to cover the insulating layer structure, then EMI shielding effectiveness is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The blocking element is formed in advance using standard semiconductor fabrication techniques (photolithography, etching, or deposition), which are already integrated into the existing manufacturing process flow. This preliminary structuring enables subsequent EMI shielding film formation without requiring fundamentally new process equipment or methods.
Solution Approach 2:
The insulating layer structure is segmented into different regions by the blocking element, creating distinct zones with different functions. This segmentation allows the EMI shielding film to be selectively positioned and thickness-controlled, simplifying the overall shielding design while maintaining manufacturing compatibility with standard processes.
Data Source
AI summary
According to an aspect of the disclosure, a semiconductor package includes: a semiconductor chip; an insulating layer structure including a first surface facing the semiconductor chip and a second surface opposite to the first surface; a plurality of redistribution layers disposed within the insulating layer structure and electrically connected to the semiconductor chip; an encapsulant on the semiconductor chip and the first surface of the insulating layer structure; a plurality of connection conductors on the second surface of the insulating layer structure and electrically connected to the plurality of redistribution layers; and a shielding layer on a portion of the insulating layer structure and at least a portion of the encapsulant, in which the insulating layer structure further comprises a blocking element positioned on the second surface of the insulating layer structure and surrounding the connection conductors.