Semiconductor Package Bond Finger Layout for EMI-Resistant Wiring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As semiconductor chips become more highly integrated, the reduction in size of chip pads and bond fingers leads to limitations in scaling down bond fingers, resulting in signal delay due to interference between signals, which is exacerbated by the difficulty in forming bond fingers and traces within the existing process techniques.
Innovation Solution
The semiconductor package design includes a package substrate with bond fingers arrayed in two columns, allowing for a maintained pitch and facilitating the formation of bond fingers without process limitations, while the chip pads are arranged in a matrix form to correspond to the bond fingers, enabling efficient electrical connection and reducing signal interference through a zigzag arrangement and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If chip pads and bond fingers are scaled down to increase integration density, then the quantity of connections increases, but signal delay and electromagnetic interference worsen due to reduced pitch between bond fingers
Solution Approach 1:
The patent transitions from a planar arrangement of bond fingers to a three-dimensional stacked configuration where bond fingers are arranged in multiple layers (first layer and second layer). This vertical dimensionality change allows increased connection density without reducing the horizontal pitch between bond fingers, thereby maintaining signal integrity while increasing the quantity of connections.
Solution Approach 2:
The patent divides the bond finger connections into multiple independent layers, with each layer containing a column of bond fingers. This segmentation allows each layer to be independently optimized and reduces electromagnetic interference between adjacent connections by separating them in the vertical dimension, thus improving signal integrity while increasing total connection capacity.
2Quantity of substance
If bond fingers are scaled down to increase integration density, then more bond fingers can be accommodated, but the difficulty of forming bond fingers and traces within existing process techniques increases
Solution Approach 1:
The patent utilizes the vertical dimension to stack multiple columns of bond fingers at different heights (first layer and second layer). This approach increases the number of bond fingers without requiring further miniaturization in the planar direction, thus avoiding the manufacturing difficulties associated with scaling down bond finger dimensions while still achieving higher integration density.
3Device complexity
If bond fingers are arranged in a single layer to simplify structure, then device complexity is reduced, but signal interference increases due to closer spacing between adjacent bond fingers
Solution Approach 1:
The patent resolves the contradiction by introducing a vertical layering dimension, arranging bond fingers in multiple stacked columns rather than a single planar layer. This three-dimensional arrangement increases the effective spacing between adjacent bond fingers by utilizing the vertical dimension, thereby reducing electromagnetic interference while maintaining relatively simple manufacturing processes and device structure.
Data Source
AI summary
A semiconductor package is configured to include a package substrate, a semiconductor chip disposed on the package substrate, and bonding wires. The package substrate includes a first column of bond fingers disposed in a first layer and a second column of bond fingers disposed in a second layer. The semiconductor chip includes a first column of chip pads arrayed in a first column and a second column of chip pads arrayed in a second column adjacent to the first column. The first column of chip pads are connected to the first column of bond fingers, respectively, through first bonding wires, and the second column of chip pads are connected to the second column of bond fingers, respectively, through second bonding wires.