Semiconductor Package Buffer Chip Layout for Low Signal Skew
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving high response speed and reducing signal skewness between multiple semiconductor chips, which affects their performance and efficiency.
Innovation Solution
A semiconductor package design that includes a substrate with a controller chip, a buffer chip positioned between upper and lower chip stacks, and bonding wires connecting these components to improve signal pathways and reduce signal skewness, enhancing response speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor chips are stacked to increase capacitance and I/O speed, then the quantity of chips and storage capacity increase, but signal skewness between chips increases and response speed deteriorates
Solution Approach 1:
A buffer chip is introduced as an intermediary component between the controller chip and the upper/lower chip stacks. The buffer chip includes buffer pads that receive signals from the controller and transmit them to the semiconductor chips, acting as a mediator to synchronize and coordinate signal transmission across multiple chips, thereby reducing signal skewness and improving response speed while maintaining high chip quantity
2Quantity of substance
If multiple semiconductor chips are stacked to increase capacitance and I/O speed, then the quantity of chips and storage capacity increase, but signal skewness between chips increases
Solution Approach 1:
The buffer chip serves as a mediator that receives signals from the controller chip through controller pads and redistributes them to upper and lower chip stacks through buffer pads. This intermediary structure synchronizes signal timing and reduces signal skewness between multiple chips, improving signal reliability while enabling higher chip density
3Device complexity
If direct wiring is used between controller chip and multiple semiconductor chips, then device complexity is reduced, but signal skewness increases and response speed decreases
Solution Approach 1:
Rather than implementing complex direct wiring between the controller chip and multiple semiconductor chips, a buffer chip is introduced as a simplified intermediary. The buffer chip receives signals from the controller through controller pads and distributes them to upper and lower chip stacks through buffer pads, reducing wiring complexity while improving response speed by synchronizing signal transmission
Data Source
AI summary
A semiconductor package may include a substrate; at least one controller chip on the substrate; at least one chip structure on the substrate, the at least one chip structure including a buffer chip, an upper chip stack on the buffer chip, and a lower chip stack below the buffer chip; an upper wire electrically connecting the upper chip stack, the buffer chip, and the at least one controller chip; a lower wire electrically connecting the lower chip stack and the at least one controller chip; a connection wire electrically connecting the at least one controller chip to the substrate; and connection bumps below the substrate, the connection bumps being electrically connected to the at least one controller chip and the at least one chip structure.