Semiconductor Package Buffering for Capacitance Reduction
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Solution Overview
Problem
As the number of semiconductor chips stacked increases, capacitance loading increases arithmetically, hindering high-speed operations in semiconductor devices.
Innovation Solution
A semiconductor package design where a first semiconductor chip group is directly electrically connected to the substrate, and a second semiconductor chip group is connected through a secondary input/output buffer of the first chip, reducing capacitance loading and enabling high-speed operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of semiconductor chips stacked increases to achieve higher capacity, then the storage capacity increases, but the capacitance loading increases arithmetically which hinders high-speed operations
Solution Approach 1:
The patent divides the chip stack into two distinct groups: a first group of chips directly connected to the substrate, and a second group of chips connected through a buffer chip. This segmentation isolates the high-speed substrate interface from the capacitance burden of multiple stacked chips, allowing high-speed operations to be maintained while achieving high storage capacity through the stacked architecture.
Solution Approach 2:
The patent introduces a buffer chip (second group) as an intermediary between the substrate and the upper chips. This buffer chip acts as a mediator that decouples the direct electrical connection between the substrate and multiple chips, thereby reducing the total capacitance loading on the substrate while still enabling multiple chips to be stacked for increased capacity.
2Quantity of substance
If multiple semiconductor chips are directly connected to the substrate in parallel, then the capacity increases, but the capacitance loading increases which compromises high-speed operations
Solution Approach 1:
The patent segments the chip connections into two categories: chips in the first group directly connected to the substrate, and chips in the second group connected through the buffer chip. This segmentation reduces the number of chips directly connected to the substrate in parallel, thereby reducing the total capacitance loading while maintaining high capacity through the stacked configuration.
Solution Approach 2:
The buffer chip serves as an intermediary that connects the second group of chips to the substrate indirectly. This intermediary structure reduces the direct capacitance burden on the substrate by introducing an additional electrical interface layer, thereby reducing harmful capacitance loading while preserving the capacity benefits of multiple stacked chips.
3Quantity of substance
If more chips are stacked to achieve high capacity, then the storage capacity increases, but the direct electrical connections to substrate increase causing speed degradation
Solution Approach 1:
The patent segments the chip stack into two functional groups with different connection architectures. The first group maintains direct connections for high-speed operations, while the second group connects through the buffer chip. This segmentation allows the system to achieve high storage capacity without proportionally increasing the number of direct high-speed connections to the substrate, thereby preventing signal transmission time degradation.
Solution Approach 2:
The buffer chip acts as an intermediary that manages the electrical connections between the substrate and the second group of chips. By routing connections through this intermediary, the patent reduces the direct signal path complexity and capacitance loading on the substrate, thereby maintaining signal transmission speeds even as more chips are stacked to increase storage capacity.
Data Source
AI summary
A semiconductor package, comprising: a substrate; a first semiconductor chip; and at least one second semiconductor chip. The first semiconductor chip and the at least one second semiconductor chip are stacked on the substrate; the first semiconductor chip is electrically connected with the substrate; and an electrical connection of each second semiconductor chip is formed through a secondary input/output buffer of the first semiconductor chip.