Semiconductor Package Layout Using Conductive Bump Alignment
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Solution Overview
Problem
The manufacturing process of semiconductor packages is complicated and adhesive reliability is decreased due to the formation of multiple layers, including a metal layer for alignment and marking patterns, which complicates the process and reduces the adhesive strength.
Innovation Solution
A semiconductor package design that includes a redistribution wiring layer with an encapsulation structure, conductive bumps, and insulating layers, where the encapsulation structure is aligned using conductive bumps instead of adhesive films, simplifying the manufacturing process and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple layers including metal layer and marking pattern are formed for alignment, then alignment precision is improved, but device complexity increases and adhesive reliability decreases
Solution Approach 1:
The patent extracts and eliminates the alignment key pattern and its corresponding metal layer from the package structure. Instead of using these separate alignment features, the invention integrates alignment functionality directly into the bonding pads through conductive bumps, thereby simplifying the manufacturing process while maintaining alignment precision.
Solution Approach 2:
The patent merges the alignment function with the bonding pad function. The bonding pads are designed to serve dual purposes: electrical connection and alignment reference. The conductive bumps on the bonding pads provide both the electrical bonding interface and the alignment key, eliminating the need for separate alignment structures.
2Manufacturing precision
If multiple layers including metal layer and marking pattern are formed for alignment, then alignment precision is improved, but adhesive reliability decreases
Solution Approach 1:
The patent removes the alignment key pattern that was previously required for proper positioning. By eliminating this separate alignment structure, the design reduces the number of interfaces and potential failure points, thereby improving adhesive reliability while maintaining alignment accuracy through the integrated bonding pad design.
Solution Approach 2:
The conductive bumps serve as an intermediary element that provides both electrical connection and alignment functionality. These bumps act as a mediator between the bonding pads and the substrate, ensuring proper alignment and strong adhesive bonding simultaneously, thus improving reliability.
3Manufacturing precision
If metal layer for alignment and marking pattern are formed, then alignment precision is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent extracts and eliminates the separate alignment key pattern and its manufacturing steps. By removing this dedicated alignment structure, the manufacturing process is simplified as fewer layers need to be deposited and patterned, while alignment precision is maintained through the integrated bonding pad design.
Solution Approach 2:
The bonding pads are designed with multi-functionality, serving both as electrical connection points and as alignment reference features. This universal design eliminates the need for separate alignment structures, thereby simplifying the manufacturing process while maintaining alignment precision.
4Ease of manufacture
If adhesive film is used for bonding, then ease of manufacture is improved, but adhesive reliability decreases due to process complexity
Solution Approach 1:
The conductive bumps serve as an intermediary bonding element that provides both electrical connection and mechanical anchoring. These bumps enhance the adhesive bonding process by providing additional surface area and mechanical interlocking, thereby improving reliability while maintaining ease of manufacture.
Solution Approach 2:
The bonding interface uses a composite structure combining adhesive material with conductive bump materials. This composite approach integrates multiple functions (electrical connection, mechanical bonding, alignment) into a single bonding step, improving reliability without compromising ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The simplified manufacturing process and increased adhesive reliability are achieved by aligning the encapsulation structure using conductive bumps, reducing the need for additional metal layers and key patterns, thereby strengthening the package.
Implementation Method 1
Conductive wires extend from a lower surface of the first sealing member to the chip pads of the plurality of semiconductor chips, respectively
Implementation Method 2
A plurality of conductive bumps is disposed on the substrate... A plurality of bonding pads is disposed in the insulating layer and is respectively in direct contact with the plurality of conductive bumps
Data Source
AI summary
A semiconductor package includes a redistribution wiring layer, an encapsulation structure disposed on the redistribution wiring layer, a plurality of conductive bumps disposed on the encapsulation structure, a second sealing member on the redistribution wiring layer covering the encapsulation structure, and partially exposing the plurality of conductive bumps, and an insulating layer covering an upper surface of the second sealing member and the plurality of conductive bumps. The encapsulation structure includes a first sealing member, a substrate disposed on an upper surface of the first sealing member, a plurality of semiconductor chips sequentially disposed within the first sealing member such that a front surface on which chip pads of each of the plurality of semiconductor chips are formed faces the redistribution wiring layer, and conductive wires extending from a lower surface of the first sealing member to the chip pads of the plurality of semiconductor chips, respectively.