Semiconductor Package Interconnects With Uniform Conductive Bump Height
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Solution Overview
Problem
The semiconductor industry faces challenges in forming semiconductor packages with complex interconnection structures, such as stacking multiple layers of solder balls in a single through hole, which are complicated and not cost-effective, leading to lower yield and reliability.
Innovation Solution
A method for forming a semiconductor package involves providing a package substrate, mounting conductive blocks, forming conductive bumps on the blocks, encapsulating them, and grinding the encapsulant and bumps to ensure uniform height of the conductive bumps relative to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple layers of solder balls are stacked in a single through hole to form higher interconnection structures, then the interconnection density is improved, but the process complexity increases and manufacturing cost increases
Solution Approach 1:
The interconnection structure is segmented into multiple functional layers: conductive blocks for vertical interconnection, conductive bumps for electrical contact, and encapsulant for protection. This segmentation allows each component to be optimized independently while achieving high interconnection density without requiring complex multi-layer solder ball stacking processes.
Solution Approach 2:
The patent transitions from planar interconnection to three-dimensional vertical interconnection by mounting conductive blocks upright on the substrate. This dimensional change enables higher interconnection density through vertical stacking of functional elements rather than lateral arrangement, simplifying the manufacturing process compared to traditional multi-layer solder ball approaches.
2Manufacturing precision
If multiple layers of solder balls are stacked in a single through hole to form higher interconnection structures, then the interconnection density is improved, but the manufacturing cost increases
Solution Approach 1:
Conductive blocks are prepared in advance with conductive bumps formed on their surfaces before mounting onto the substrate. This preliminary preparation allows for standardized mass production of interconnection elements, reducing overall manufacturing cost compared to complex multi-step solder ball stacking processes.
Solution Approach 2:
The patent changes the physical state and arrangement parameters of conductive elements from horizontal solder ball layers to vertical conductive blocks with surface-mounted bumps. This parameter change enables simpler, more cost-effective manufacturing while achieving the same interconnection density goal.
3Reliability
If complicated interconnection formation processes are used to achieve higher interconnect structures, then the interconnection capability is improved, but the yield of semiconductor packages decreases
Solution Approach 1:
The conductive blocks are designed to be self-aligning and self-supporting structures that mount directly onto the substrate without requiring complex alignment and bonding processes. This self-service approach to interconnection formation eliminates many potential failure points in the manufacturing process, improving package yield while maintaining interconnection capability.
Solution Approach 2:
Conductive bumps are formed on the conductive blocks before mounting, ensuring proper electrical contact is pre-established. This preliminary action prevents contact failures during assembly, improving overall package yield without requiring complex post-assembly interconnection processes.
4Ease of manufacture
If conductive blocks are mounted on the substrate without height adjustment, then the manufacturing process is simplified, but the exposed surfaces of conductive bumps are at different heights
Solution Approach 1:
The conductive blocks are designed with varying heights or mounting configurations to achieve uniform exposed bump surfaces. This local quality adjustment allows each block to be customized for its specific position, ensuring all conductive bumps reach the same height while maintaining overall process simplicity.
Solution Approach 2:
The height of conductive blocks or their mounting structures is predetermined and prepared in advance during block fabrication or substrate preparation. This preliminary height adjustment eliminates the need for complex post-mounting height equalization processes, maintaining manufacturing simplicity while achieving bump height uniformity.
Data Source
AI summary
A semiconductor package and a method for making the same are provided. The method includes: providing a package substrate having a first surface and a second surface opposite to the first surface; mounting a plurality of conductive blocks onto the first surface of the package substrate; forming at least one conductive bump on each of the conductive blocks; forming a first encapsulant on the first surface of the package substrate to encapsulate the conductive blocks and the conductive bump on each of the conductive blocks; and grinding the first encapsulant to remove an upper portion of the first encapsulant and an upper portion of the conductive bump on each of the conductive blocks, such that an exposed surface of the conductive bump on each of the conductive blocks is at a same height relative to the first surface of the package substrate.