Semiconductor Package Central Hole Bushing Thermal Mounting
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Solution Overview
Problem
Conventional power integrated modules with rigid plastic covers face challenges in heat dissipation and mechanical mounting due to fixed screw holes, which limit their thermal management and flexibility in mounting to heat sinks.
Innovation Solution
The semiconductor packages feature a substrate with a central hole and bushing, coupled with pin holders, encapsulated by a molding compound, allowing for flexible mounting and improved thermal distribution through the use of copper or steel bushings and pin holders soldered to the substrate, along with a molding compound that covers the bushing and pin holders' side surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If rigid plastic covers with fixed screw holes are used, then manufacturing simplicity is maintained, but thermal management capability and mounting flexibility deteriorate
Solution Approach 1:
The package structure is segmented into distinct functional components: a substrate with through-holes for mechanical mounting, separate heating elements, and a flexible encapsulant material. This segmentation allows each component to perform its specific function optimally while maintaining ease of manufacture through modular assembly.
Solution Approach 2:
The patent employs composite material structures, particularly the encapsulant material that combines flexible polymer properties with thermal management capabilities. The substrate itself may be a composite structure combining electrical insulation with thermal conductivity pathways, enabling both mechanical simplicity and thermal performance.
2Stability of the object's composition
If rigid plastic covers are used, then structural stability is maintained, but heat dissipation capability deteriorates
Solution Approach 1:
The encapsulant material exhibits local quality variations: it remains rigid in regions requiring structural support while becoming more flexible in areas needing thermal expansion accommodation. The substrate provides localized rigid mounting points through its through-holes while the overall structure maintains flexibility for thermal management.
Solution Approach 2:
The patent utilizes parameter changes in the encapsulant material, specifically its viscoelastic properties, to transition between rigid and flexible states. This allows the material to provide structural stability during assembly while enabling heat dissipation through controlled deformation and thermal pathways during operation.
3Ease of manufacture
If fixed screw holes in plastic covers are used, then manufacturing process is simplified, but thermal management effectiveness deteriorates
Solution Approach 1:
The substrate acts as an intermediary component between the mounting structure and the heating elements. Its through-holes provide mechanical attachment while conducting heat away from critical areas. The encapsulant material serves as another intermediary, creating thermal pathways that distribute heat efficiently while maintaining the simple manufacturing process.
4Strength
If rigid encapsulation is used, then protective coverage is maintained, but stress distribution on substrate deteriorates
Solution Approach 1:
The encapsulant material exhibits dynamic mechanical properties, transitioning from a rigid protective shell during assembly to a more compliant structure during thermal cycling. This dynamic behavior allows it to maintain protective coverage while adapting to stress changes, distributing loads more evenly across the substrate throughout the product lifecycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal management and mechanical stability by distributing forces effectively, reducing stress on the substrate and components, and permits the use of advanced molding processes like MAP, enabling efficient heat dissipation and secure mounting to heat sinks.
Implementation Method 1
The bushing and the plurality of pins holders may each be coupled to the substrate through solder
Implementation Method 2
The bushing and the plurality of pins holders may each be coupled to the substrate through solder
Data Source
AI summary
Implementations of semiconductor packages may include: a substrate comprising a first side and a second side and a hole in the substrate. The hole extending from the first side to the second side of the substrate and positioned in a center of the substrate. The semiconductor packages may also include a bushing around the hole to the first side of the substrate. The semiconductor packages may also include a plurality of pin holders arranged and coupled on the substrate. The semiconductor package may also include a molding compound at least partially encapsulating the substrate, encapsulating a side surface of the bushing, and encapsulating a plurality of side surfaces of the plurality of pin holders.