Semiconductor Package Carrier Removal for Thermal Management

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Solution Overview

Problem

Current semiconductor packaging methods face challenges in balancing manufacturability, thermal management, and package dimensions, which affect cost, application, and reliability.

Innovation Solution

A semiconductor packaging method involving a carrier with chip receiving areas, where semiconductor chips are attached, encapsulated, and connected with electrical connections, and a heat release area is created by removing a portion of the carrier to facilitate heat dissipation, with options for various heat release configurations such as die pads, conductive layers, heat sinks, and fins.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a carrier is used to support semiconductor chips during packaging, then manufacturability and assembly ease are improved, but the package thickness increases and heat dissipation is hindered

Engineering Contradiction:

Improveassembly easeVSAvoidpackage thickness

Core Design Contradiction:

Ease of manufactureVSLength of stationary object

Solution Approach 1:

The patent removes the carrier substrate after chip mounting and wire bonding, extracting only the necessary support function during assembly. This leaves a thin-profile package without the bulky carrier, resolving the contradiction between assembly ease (provided by carrier) and package thickness (reduced by removal).

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The carrier is used temporarily during the assembly process to provide support and alignment, then removed after serving its purpose. This preliminary use allows easy assembly during manufacturing while achieving thin final package dimensions, resolving the contradiction between manufacturability and package thickness.

Inventive Principle:

Principle #10Preliminary action

2Strength

If a carrier substrate is retained in the package structure, then mechanical support is improved, but heat dissipation from semiconductor chips is reduced

Engineering Contradiction:

Improvemechanical supportVSAvoidheat dissipation

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The carrier substrate is extracted/removed from the final package structure, eliminating the thermal barrier it creates. This allows direct heat dissipation from chips to the underlying support structure or environment, resolving the contradiction between mechanical support (provided by carrier) and heat dissipation (improved by removal).

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent converts the harmful thermal insulation effect of the carrier substrate into a benefit by removing it, allowing the carrier's temporary mechanical support function to be achieved while eliminating its harmful thermal blocking effect in the final structure.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Temperature

If the carrier is removed to improve heat dissipation, then thermal management is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveheat dissipationVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The carrier is used in advance during manufacturing to simplify assembly operations, then removed after serving its temporary purpose. This preliminary use reduces manufacturing complexity during critical assembly steps while achieving improved heat dissipation in the final package, resolving the contradiction between thermal management and manufacturing complexity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The carrier acts as an intermediary tool during manufacturing that simplifies the assembly process, then is removed to enable direct thermal pathways. This intermediary function resolves the contradiction by providing manufacturing simplicity temporarily while enabling thermal management in the final structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the production of thin profile semiconductor packages with improved heat management, reduced assembly costs, and enhanced reliability by effectively releasing heat generated by the semiconductor chips.

Implementation Method 1

a heat release area arranged to release heat generated by the first semiconductor chip

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a surface area of a plurality of fins attached to a conductive layer

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS10854531B2Semiconductor packaging method, semiconductor package and stacked semiconductor packages

Publication Date: 2020.12.01 PEP INNOVATION PTE LTD

AI summary

A semiconductor packaging method, a semiconductor package and stacked semiconductor packages are provided. The method includes providing a carrier (10) having a plurality of semiconductor chip receiving areas (12) and attaching a plurality of first semiconductor chips (14) to the semiconductor chip receiving areas (12). The first semiconductor chips (14) are encapsulated with a first encapsulant (20) and a plurality of electrical connections (24) is formed to the first semiconductor chips (14). At least a portion of the carrier (10) is removed to provide a heat release area (38).