Semiconductor Package Cavity Layout for Thin Profile Heat Dissipation
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Solution Overview
Problem
Thermal characteristics of semiconductor packages with stacked semiconductor chips deteriorate as the thickness of the semiconductor chip is reduced, leading to decreased thermal performance.
Innovation Solution
A semiconductor package design that includes a lower substrate with redistribution wirings, a first semiconductor chip with a silicon substrate and activation layer, connecting members, and an upper substrate with through cavities to accommodate the chip, allowing for improved heat dissipation while maintaining the overall thickness of the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the thickness of the semiconductor chip is reduced, then the overall package thickness can be decreased, but the thermal characteristics deteriorate
Solution Approach 1:
The patent introduces a through cavity extending through the upper substrate in the vertical dimension, allowing the semiconductor chip to be recessed into the package structure. This dimensional reconfiguration enables the chip thickness to be effectively reduced while maintaining adequate thermal path length through the substrate, resolving the contradiction between package thickness reduction and thermal characteristic preservation
2Temperature
If the thickness of the semiconductor chip is increased to improve thermal characteristics, then the thermal resistance is reduced, but the overall package thickness increases
Solution Approach 1:
The semiconductor chip is nested within the through cavity of the upper substrate, creating a recessed configuration. This nesting allows the chip to be positioned lower in the package structure, enabling the use of thicker chips for improved thermal characteristics while maintaining a compact overall package thickness by utilizing the vertical space within the cavity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal characteristics by increasing the thickness of the silicon substrate, reducing the mold gap, and improving heat spreading, thereby maintaining the package's performance and efficiency.
Implementation Method 1
the first semiconductor chip may transfer heat generated from the activation layer to the first surface of the silicon substrate
Implementation Method 2
The chip redistribution wiring layer may absorb the heat and dissipate it upward
Data Source
AI summary
A semiconductor package includes a lower substrate that includes a chip mounting region and a peripheral region, where the lower substrate includes lower redistribution wirings; a first semiconductor chip on the chip mounting region, where the first semiconductor chip includes: a silicon substrate that includes a first surface and a second surface that are opposite to each other, an activation layer on the second surface, and a chip redistribution wiring layer that is on the first surface and includes a plurality of chip redistribution wirings that are electrically insulated from the activation layer; a plurality of connecting members that are on the peripheral region and are electrically connected to the lower redistribution wirings; and an upper substrate on the plurality of connecting members, and where at least a portion of the first semiconductor chip is in a through cavity defined by the upper substrate.