Semiconductor Package Cavity Structure for Terminal Density and Reliability

The patent transitions from a two-dimensional planar arrangement of connection terminals to a three-dimensional vertical stacking architecture. Multiple semiconductor chips and connection structures are arranged in vertical layers, allowing increased number of external connection terminals without proportionally increasing the planar footprint. This dimensional change enables higher terminal density while controlling package area.

The patent implements nested structures where connection structures, metal patterns, and multiple chips are arranged concentrically and vertically within the package. The connection structures extend from the base layer through intermediate layers to upper chips, creating a nested configuration that maximizes the use of vertical space and increases terminal count without linearly increasing planar area.

The patent forms metal patterns and connection structures in advance during the manufacturing process, before final chip assembly. The metal patterns are pre-formed on base layers and intermediate structures, and connection structures are pre-assembled, enabling modular integration and reducing final assembly complexity. This preliminary action streamlines manufacturing and controls costs despite increased terminal count.

The patent divides the package into modular segments including base layers, intermediate connection structures, and upper chip assemblies. Each segment can be manufactured and prepared independently, then integrated through standardized connection interfaces. This segmentation enables parallel manufacturing processes and reduces overall manufacturing complexity and cost.