Semiconductor Package Cavity Layout for Compact Reliable Sealing
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
A semiconductor device design comprising a substrate with a conductive structure, an electronic component with interface elements and terminals, a lid for protection, and a buffer layer between the component and the body, along with external interconnects, which provides a compact and reliable packaging solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packaging methods are used, then manufacturing cost is reduced, but reliability decreases and package size increases
Solution Approach 1:
The patent implements nesting by placing the electronic component (die) inside a cavity formed in the substrate, and further enclosing it with a lid that has a seal. The buffer material fills the remaining space within the substrate cavity, creating a nested structure where each element is contained within the previous one. This nested arrangement achieves compact packaging while maintaining reliability through proper sealing and protection.
Solution Approach 2:
The patent transitions from traditional planar packaging to a three-dimensional structure by forming a cavity within the substrate and placing the component vertically within this cavity. The lid seals the top opening, creating a enclosed volume that utilizes the third dimension (depth) for component placement, thereby reducing the overall package footprint while maintaining component protection and electrical connections.
2Ease of manufacture
If conventional semiconductor packaging methods are used, then manufacturing simplicity is maintained, but cost increases and performance decreases
Solution Approach 1:
The patent merges multiple functions into the substrate structure itself: the substrate provides both the mounting surface for the component and the structural housing (cavity) that encloses it. The conductive traces in the substrate serve dual purposes as both electrical interconnects and structural elements. This consolidation of functions reduces the number of separate components needed, simplifying manufacturing while reducing material costs.
3Volume of stationary object
If conventional semiconductor packaging methods are used, then package size is reduced, but reliability decreases
Solution Approach 1:
The patent incorporates a buffer material that fills the cavity space between the electronic component, substrate walls, and lid. This buffer material serves as a cushioning element that absorbs mechanical stress, thermal expansion differences, and manufacturing tolerances before they can affect the component. By providing this protective cushioning in advance, the package maintains high reliability despite the compact size.
Solution Approach 2:
The seal structure acts as an intermediary element between the internal component environment and the external package environment. It provides a transition zone that protects the component from moisture and contaminants while allowing for controlled thermal and mechanical expansion. This intermediary sealing mechanism enables compact packaging without compromising reliability.
Data Source
AI summary
In one example, a semiconductor device comprises a substrate comprising a top side, a bottom side, and a conductive structure, a body over the top side of the substrate, an electronic component over the top side of the substrate and adjacent to the body, wherein the electronic component comprises an interface element on a top side of the electronic component, a lid over the interface element and a seal between the top side of the electronic component and the lid, and a buffer on the top side of the substrate between the electronic component and the body. Other examples and related methods are also disclosed herein.