Semiconductor Package with Configurable Channel Modes
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Solution Overview
Problem
Conventional semiconductor packages are inflexible and cannot be easily modified to meet specific user requirements for data interconnectors, leading to suboptimal performance due to standardized manufacturing processes that do not accommodate individual usage conditions and requirements.
Innovation Solution
A semiconductor package design featuring a circuit board with integrated circuit (IC) chip structures and an operation controller that includes a channel controller and bit organization controller, allowing for selective configuration of channel modes and data transfer lines through switching units and mirror pads, enabling operation in various channel and bit organization modes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If standardized manufacturing processes are used for semiconductor packages, then manufacturing efficiency and consistency are improved, but adaptability to specific user requirements deteriorates
Solution Approach 1:
The patent implements dynamic configurability in semiconductor packages through switching units that can change channel connections and bit organizations during operation. The package can be reconfigured between different channel modes (1-channel, 2-channel, 4-channel) and bit organizations (x4, x8, x16) based on user requirements, making the system adaptable without requiring different manufacturing processes for each configuration.
Solution Approach 2:
The patent creates a universal semiconductor package design that can perform multiple functions through a single standardized manufacturing process. By incorporating switching units and control logic, a single package design can serve multiple channel configurations and bit organizations, eliminating the need for separate standardized processes for each package type.
2Manufacturing precision
If separate processing steps are created for different channel configurations, then manufacturing precision for each configuration is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent employs a universal manufacturing process that produces semiconductor packages capable of supporting multiple channel configurations (1-channel, 2-channel, 4-channel) and bit organizations (x4, x8, x16) through integrated switching units. This single process design eliminates the need for separate processing lines for each configuration, reducing overall device complexity while maintaining manufacturing precision through standardized fabrication techniques.
Solution Approach 2:
The patent incorporates dynamic switching units that can reconfigure channel connections and bit organizations after manufacturing, allowing a single standardized package to adapt to different configuration requirements. This dynamic capability removes the need for precision-crafted separate processing steps for each configuration, as the adaptability is achieved through post-manufacturing reconfiguration rather than pre-manufacturing specialization.
3Ease of manufacture
If fixed channel configurations are used in semiconductor packages, then manufacturing simplicity is improved, but adaptability to different usage conditions deteriorates
Solution Approach 1:
The patent implements dynamic reconfiguration capability within semiconductor packages through switching units controlled by control logic. These switching units enable the package to change channel connections and bit organizations based on usage conditions, maintaining manufacturing simplicity through standardized processes while achieving adaptability through post-manufacturing reconfiguration.
Solution Approach 2:
The patent segments the package into modular components including switching units, control logic, and configurable channel structures. This segmentation allows each component to be manufactured using standard processes while enabling flexible combination and reconfiguration to meet different usage conditions, thus maintaining manufacturing simplicity while achieving adaptability.
Data Source
AI summary
In a semiconductor package, a circuit pattern is arranged in a circuit board and contact pads on the circuit board are connected with the circuit pattern. Contact terminals contact external contact elements on a first surface of the circuit board. An integrated circuit (IC) chip structure is mounted on the circuit board and electrically connected to the inner circuit pattern. An operation controller on the circuit board controls operation of the semiconductor package according to the package users' individual choice.