Semiconductor Package Heat Transfer Member for Stacked Chip Cooling
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Solution Overview
Problem
Semiconductor devices generate heat during operation, leading to performance degradation and potential damage due to inadequate heat dissipation, particularly affecting image sensors which are sensitive to heat.
Innovation Solution
A semiconductor package and device design incorporating a heat transfer member between semiconductor chips and a system substrate to efficiently dissipate heat, enhancing thermal management and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If semiconductor devices operate at high power, then performance and functionality are improved, but heat generation increases causing temperature rise and potential damage
Solution Approach 1:
The patent extracts the heat dissipation function from the package substrate by introducing a dedicated heat transfer member that directly contacts the image sensor chip. This separate heat transfer path removes heat from the image sensor chip before it can raise the temperature of the package substrate and other components, allowing high power operation without excessive temperature rise.
Solution Approach 2:
The heat transfer member acts as an intermediary between the image sensor chip and the package substrate. It provides a dedicated thermal conduction path that mediates heat transfer, enabling efficient heat removal from the heat-sensitive image sensor chip while isolating it from the thermal effects of high power operation in other device components.
2Temperature
If heat dissipation structures are added to manage thermal load, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heat transfer member serves multiple functions simultaneously: it provides thermal conduction to remove heat from the image sensor chip, acts as a mechanical support structure, and functions as part of the overall package assembly. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving effective heat dissipation.
3Productivity
If multiple semiconductor chips are integrated in a stacked configuration, then device functionality and integration density are improved, but heat accumulation increases affecting adjacent chips
Solution Approach 1:
The patent segments the heat dissipation function from the overall package structure by introducing a dedicated heat transfer member that creates an independent thermal management path for the image sensor chip. This segmentation allows heat to be removed from the image sensor chip separately, preventing heat accumulation that would otherwise affect adjacent chips in the stacked configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation characteristics, reduces heat transfer to adjacent chips, and reinforces mechanical strength, thereby enhancing performance and reliability of semiconductor devices.
Implementation Method 1
a heat transfer member between the second semiconductor chip and the system substrate
Data Source
AI summary
Provided is a semiconductor package that may improve heat dissipation performance, including a package substrate on a system substrate, in which the package substrate includes a first surface and a second surface opposite the first surface, the second surface facing the system substrate, a connection member electrically connecting the system substrate and the package substrate, a first semiconductor chip on the first surface of the package substrate, a second semiconductor chip on the second surface of the package substrate, and electrically connected to the first semiconductor chip, and a heat transfer member between the second semiconductor chip and the system substrate.