Semiconductor Package Alignment Solder Joints to Prevent Chip Drift
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Solution Overview
Problem
Current semiconductor packaging methods face challenges such as warpage, chip drift, and surface coplanarity issues, leading to positional mismatches and reduced production efficiency, especially in fan-out packaging, where high precision placement is costly and limited by equipment constraints.
Innovation Solution
A novel semiconductor packaging method utilizing alignment solder joints between the semiconductor device and a carrier board, where first and second alignment solder parts align and solder to fix the device precisely, leveraging the principle of minimum surface energy for self-alignment and solidification to prevent warping and drifting, thus improving placement accuracy and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high precision mounting equipment is used for placement and attachment of semiconductor devices, then manufacturing precision is improved, but device complexity and production cost increase
Solution Approach 1:
The solder parts perform self-alignment through surface energy minimization during soldering, eliminating the need for complex high-precision mounting equipment. The system uses the inherent physical property of solder (surface energy) to achieve automatic alignment, making the placement process self-correcting and reducing equipment complexity
Solution Approach 2:
The patent replaces mechanical precision positioning systems with a thermal-energy-based soldering system. Instead of relying on mechanical alignment mechanisms, the invention uses the surface energy minimization effect during soldering to achieve automatic alignment, substituting a complex mechanical system with a simpler thermal-chemical process
2Manufacturing precision
If high precision mounting equipment is used for placement and attachment of semiconductor devices, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
The solder parts automatically align themselves through surface energy minimization during the soldering process, eliminating the need for slow, precision-adjustment-heavy mechanical placement. This self-aligning mechanism significantly speeds up the placement process while maintaining high precision, thereby improving productivity
Solution Approach 2:
The patent utilizes the phase transition of solder from solid to liquid during heating, and back to solid during cooling. During the liquid phase, the solder flows to minimize surface energy, achieving automatic alignment. This phase transition mechanism enables rapid, self-correcting alignment that is much faster than mechanical adjustment processes
3Device complexity
If conventional packaging methods are used, then device complexity is reduced, but manufacturing precision deteriorates due to warpage and chip drift
Solution Approach 1:
The patent pre-forms alignment solder parts on both the semiconductor device and carrier board before the actual placement process. These pre-formed solder parts are positioned at specific locations to guide subsequent self-alignment during soldering, enabling simple processes to achieve high precision outcomes
Solution Approach 2:
The invention replaces complex mechanical alignment and fixation systems with a simpler soldering-based alignment system. The surface energy minimization effect during soldering automatically corrects placement errors, achieving high precision without complex mechanical alignment mechanisms
4Manufacturing precision
If alignment solder joints are formed using surface energy minimization, then manufacturing precision is improved, but use of energy increases during soldering
Solution Approach 1:
The patent utilizes the phase transition of solder from solid to liquid and back to solid to achieve alignment. The energy input is concentrated and temporary, only required during the brief melting and solidification process. The surface energy minimization effect occurs naturally during this phase transition without requiring continuous energy input, making the energy consumption acceptable for achieving high precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances precision and reduces production costs by allowing for less precise initial placement, prevents warping and drifting, and increases packaging efficiency, enabling more accurate and reliable alignment and fixation of semiconductor devices.
Implementation Method 1
leveraging the principle of minimum surface energy for self-alignment and solidification
Data Source
AI summary
A semiconductor packaging method, a semiconductor assembly and an electronic device comprising the semiconductor assembly are disclosed herein. The semiconductor packaging method comprises providing at least one semiconductor device and a carrier board. A plurality of first alignment solder parts are formed on a passive surface of the semiconductor device, and a plurality of corresponding second alignment solder parts are formed on the carrier board. The method further comprises forming a plurality of alignment solder joints by aligning and soldering the first alignment solder parts to respective ones of the second alignment solder parts whereby the semiconductor device is aligned and fixed to the carrier board; encapsulating the at least one semiconductor device to form a molded package body; sequentially forming a redistribution layer and external terminals on the molded package body so that the connection terminals are connected to the external terminal through the interconnection layer.